Simulation of a novel lateral axis micromachined gyroscope in the presence of fabrication imperfections

Lyu, Bo; Liu, Xuesong; Yang, Zhenchuan; Yan, Guizhen

doi:10.1007/s00542-007-0495-x

Cited by 8 publications

(4 citation statements)

References 5 publications

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“…In the simulation, it was assumed that the drive direction is perfectly aligned to the axis which is not the case in the fabricated device leading to quadrature error. Additionally, asymmetric defects lead to an increase of mechanical cross coupling [16], therefore common mode errors do not ideally cancel as intended by the design; this further increases the mechanical cross coupling.…”

Section: Implementation and Experimental Resultsmentioning

confidence: 99%

A High-Resolution Silicon-on-Glass $Z$ Axis Gyroscope Operating at Atmospheric Pressure

et al. 2010

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Abstract-This paper describes a high-resolution silicon-onglass axis gyroscope operating at atmospheric pressure. The mechanical structure is designed in such a way that it exhibits low cross coupling between drive and sense mode of less than 0.5% simulated using finite-element method and 1.35% verified by experimental measurements. Due to a symmetrically designed structure, the specified bandwidth can be maintained despite of fabrication imperfections. The fabrication process flow is based on a combination of silicon on glass bonding and deep reactive ion etching which results in a large proof mass and capacitances. A closed loop self-oscillation drive interface is used to resonate the gyroscope in the drive mode, which reaches steady-state after 150 ms. Using area-varying capacitors, large quality factors of 217 and 97 for drive and sense mode, respectively, were achieved operating at atmospheric pressure. A low drive voltage, with a 1 V peak-peak

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Section: Implementation and Experimental Resultsmentioning

confidence: 99%

A High-Resolution Silicon-on-Glass $Z$ Axis Gyroscope Operating at Atmospheric Pressure

et al. 2010

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“…DRIE typically results in footing and sidewall etching problems because of the non-uniform etch rate [16]. For example, as shown in figures 3(a)-(d), regions in which the silicon layer has been completely etched may be attacked, while other parts of the wafer are yet to be perforated; this can lead to non-vertical sidewalls and artifacts around the foot of the trench.…”

Section: Robustness To Fabrication Tolerancesmentioning

confidence: 99%

A gyroscope fabrication method for high sensitivity and robustness to fabrication tolerances

Sung¹,

Kim²,

Seok³

et al. 2014

J. Micromech. Microeng.

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MEMS gyroscopes have favorable characteristics, including small size, high throughput, and low cost. The performance of MEMS gyroscopes depends on the displacement sensitivity of the capacitors. In this paper, we describe the fabrication of 300-µm-thick gyroscopes that can provide high displacement sensitivity and are robust to fabrication tolerances, i.e. deep reactive ion etch (DRIE) rate uniformity. When thick structures are perforated using DRIE to achieve high-aspect-ratio features, footing is commonly observed. However, we describe a fabrication method that circumvents problems associated with footing and side-wall etching, so that the gyroscopes can have uniform dimensions and small variations across the wafer. Using a post-fabrication translation approach, the position of capacitors is modified following DRIE, and the gap in the gyroscopes can be reduced to 3 μm, which leads to an aspect ratio of 100. Using this method, we fabricated MEMS gyroscopes that can overcome the DRIE aspect ratio limit and have capacitors with higher sensitivities than those of other gyroscopes, which typically employ substrates that are less than 100 µm thick. The gyroscope had a resonant frequency of 9.91 kHz, a quality factor of 2500 and a sensitivity of 23 mV/[deg/s].

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“…Previously, effect of fabrication imperfections in MEMS gyroscopes is investigated through developing the theoretical models from the lumped-mass-spring systems (Gyimesi and Ketal 2004;Zhang et al 2006) but these have limitations in analyzing the asymmetric defects and imperfections along with the many approximations made in developing the theoretical models. Nodal analysis and finite element method (FEM) based simulations (Ha et al 2006;Iyer and Mukherjee 2002;Xiao et al 2004;Bo et al 2008;Han and Kwak 2001) have been used to address the fabrication induced asymmetric defects. But difficulty in building 3D models with the nodal analysis method and the time consuming FEM simulations make these approaches generally impractical for complex structured MEMS gyroscopes.…”

Section: Introductionmentioning

confidence: 99%

Design and robustness analysis of structurally decoupled 3-DoF MEMS gyroscope in the presence of worst-case process tolerances

Saleem

Bazaz

2011

Microsyst Technol

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This paper presents design of a structurally decoupled 3-DoF non-resonant MEMS gyroscope with increased robustness and gain. The proposed design utilizes dynamic amplification in 2-DoF drive mode oscillator to achieve large gain. The device performance is verified through behavioral model simulations considering the fabrication limitations of standard electroplated nickel micromachining process, MetalMUMPs, of 20 lm structural layer thickness. A wide operational bandwidth of 1.74 kHz with dynamically amplified again of 0.2 lm is achieved at low actuation voltages. A design sensitivity and Monte Carlo analysis is carried out to show the robustness of the design, without any feedback control, within the fabrication process tolerances. Moreover to verify the device performance under the application of angular velocity, a rate table characterization is carried out which resulted in sense mass displacement of 30 nm corresponding to the rotation induced Coriolis force at actuation voltage of 20 V ac and 30 V dc with angular rotation of 50 rad/s. Behavioral model simulations proved to be an cost-effective and time-saving alternative to the traditional iterative fabrications and physical level simulations.

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Simulation of a novel lateral axis micromachined gyroscope in the presence of fabrication imperfections

Cited by 8 publications

References 5 publications

A High-Resolution Silicon-on-Glass $Z$ Axis Gyroscope Operating at Atmospheric Pressure

A High-Resolution Silicon-on-Glass $Z$ Axis Gyroscope Operating at Atmospheric Pressure

A gyroscope fabrication method for high sensitivity and robustness to fabrication tolerances

Design and robustness analysis of structurally decoupled 3-DoF MEMS gyroscope in the presence of worst-case process tolerances

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