Simulation study for lifetime distribution of middle-of-line time-dependent dielectric breakdown affected by global and local spacing variations

Abstract

The impact of process fluctuations for the lifetime distribution of middle-of-line time-dependent dielectric breakdown was investigated by Monte-Carlo simulation. Global and local variations were simulated using a doubly truncated normal distribution. A goodness of fit to the generated data was determined statistically in terms of the Weibull distribution and clustering model. A change in the standard deviation of the global variation shows a large contribution to lifetime variation. However, it does not affect the average lifetime. A change in the standard deviation of the local variation contributes to both the average lifetime and the distribution variation. The upper limit of the process variation induces the convex upward shape of the lifetime distribution on the Weibull plot. The clustering model well explains the distribution shape.

Applications of lifetime distribution functions with two shape parameters for reliability analysis in advanced interconnect technologies: a brief review

“…In this case, the probability plot shows a convex upward shape. [9][10][11][12][13][14][15][16][17][18] In the semiconductor reliability domain, as mentioned above, the Weibull distribution is assumed for dielectric breakdown with a temporospatial homogeneousness. Particularly, the weakest link concept will correspond to the TDDB lifetime.…”

“…The applications of a TDC model that describes the non-Poisson characteristics of a lifetime applied to TDDB are introduced. The physical and statistical background of the modeling and the mathematical methods for the accurate parameter extraction [14][15][16][17][18] are introduced. These elements provide methods to analyze and evaluate the TDDB characteristics affected by complicated defect densities.…”

Bayesian inference of a lifetime distribution parameter on the time-dependent dielectric breakdown with clustering defects

“…Wu et al had reported their progressive research about this concept. [8][9][10][11] The lifetime distribution function, which is proposed as the time-dependent clustering (TDC) model, has two shape parameters as follows: [8][9][10][11][12]27,28)…”

Statistical evaluation method for lifetime distribution in field-accelerated time-dependent dielectric breakdown using two-step probability plot and multilink test scheme

“…3,4,[25][26][27][28][29] The model has two shape parameters and is called the generalized Burr-type XII (GBXII) distribution in statistics. 30,31) The cumulative probability function of the lifetime distribution with defect clustering is described by the BXII distribution as…”

“…A complicated shape of the TDDB lifetime distribution 3,4,[25][26][27][28][29] is represented by both the intrinsic variation of TDDB and the physical variation of acceleration stress. Therefore, large-scale observation of lifetime is required for evaluating the lifetime distribution of TDDB affected by the clustering defect.…”