“…On the other hand, Si BTBT devices have the advantage of CMOS compatibility, and features such as negative differential conductance (NDC), reported in Esaki (tunnel) diodes from large scale 7) to Si nanowires, 8) or negative differential transconductance (NDT), more recently reported in gated p + -i-n + devices, 9,10) are attractive for future advanced operations of Si-based electronic circuits. Such operations can include, for example, energy-efficient electronics switches, 4) logic gates with tunable carrier polarities 11,12) or multi-value logic applications based on the resonant tunneling diode mechanism 13,14) or single-charge BTBT mechanism, 15) similarly to those based on single-electron/ hole tunneling transistors. [16][17][18] In the majority of these reports, however, highly doped p + and n + Si regions are used [with concentrations well above the metal-insulator transition (MIT), known for doped bulk Si to be N D MIT ≈ 3.74 × 10 18 cm −3 for phosphorus (P) 19) and N A MIT ≈ 4.06 × 10 18 cm −3 for boron (B)].…”