2016 16th European Conference on Radiation and Its Effects on Components and Systems (RADECS) 2016
DOI: 10.1109/radecs.2016.8093192
|View full text |Cite
|
Sign up to set email alerts
|

Single event multiple transient (SEMT) measurements in 65 nm bulk technology

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
2

Citation Types

0
11
0

Year Published

2016
2016
2024
2024

Publication Types

Select...
6
2

Relationship

0
8

Authors

Journals

citations
Cited by 21 publications
(11 citation statements)
references
References 15 publications
0
11
0
Order By: Relevance
“…The works in [20,21] are based on probabilistic models and statistical methods for SER estimation. However, modern chips tend to be more vulnerable to high-energy particle strikes due to the technology downscaling and, thus, the reduction in the distance among the cells has increased the occurence of multiple transient faults (MTFs) caused by a single particle strike [22][23][24][25][26]. Therefore, recently, research in the particular field focuses on the SER evaluation in the presence of single event multiple transients (SEMTs).…”
Section: Related Workmentioning
confidence: 99%
See 1 more Smart Citation
“…The works in [20,21] are based on probabilistic models and statistical methods for SER estimation. However, modern chips tend to be more vulnerable to high-energy particle strikes due to the technology downscaling and, thus, the reduction in the distance among the cells has increased the occurence of multiple transient faults (MTFs) caused by a single particle strike [22][23][24][25][26]. Therefore, recently, research in the particular field focuses on the SER evaluation in the presence of single event multiple transients (SEMTs).…”
Section: Related Workmentioning
confidence: 99%
“…Therefore, recently, research in the particular field focuses on the SER evaluation in the presence of single event multiple transients (SEMTs). In [23], heavy-ion experiments are conducted to characterize the SEMTs. In [26,27], the authors introduce the identification of the cell sensitive regions for SER estimation.…”
Section: Related Workmentioning
confidence: 99%
“…As process feature sizes continue to shrink, clock frequencies continue to increase, node capacitance and supply voltage decrease, the critical charge of transient pulses is reduced [3][4][5], and waveforms are more easily captured and soft errors are formed. It has been reported that SET are the main cause of soft errors in space applications [6,7], and charge sharing may even affect multiple nodes and cause single-event multiple transients (SEMT) [8][9][10]. These problems are already common in combinatorial logic circuits.…”
Section: Introductionmentioning
confidence: 99%
“…The load resistance and line capacitance of the test system cause large pulse distortion, and the on-chip measurement is believed to be a better solution in most applications, and Narasimham et al [20] invented a self-triggering technique for measuring SET pulses in 130 nm and 90 nm chips in Reference [12]. In other processes, there are also examples [3,9,13,14] of successful use of this measurement method. On the basis of this method, Huang et al [8] proposed a structure that can simultaneously measure multiple transient pulses, using eight capture circuits to share a self-trigger structure design, which can measure the SEMT.…”
Section: Introductionmentioning
confidence: 99%
“…This was less of a concern in old CMOS technologies where single particles only affected single digital cells. However, as technologies have scaled down, Multi-Bit Upsets (MBU) have become a serious concern such that one particle can affect multiple gates simultaneously [10][11][12]. With improper placement, the fault tolerance can dramatically reduce, especially in fast designs.…”
Section: Introductionmentioning
confidence: 99%