Single Summation Expression for the Impedance of Rectangular PCB Power-Bus Structures Loaded With Multiple Lumped Elements

Hampe, Matthias; Palanisamy, V.A.; Dickmann, Stefan

doi:10.1109/temc.2006.888188

Cited by 27 publications

(11 citation statements)

References 11 publications

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“…The rectangular power plane, which features the simplest geometry, has been efficiently modeled by the cavitylumped model [16] - [18]. The decoupling capacitor is taken into account by the transmission line elements method [19] - [20]. The above approaches are fast and accurate.…”

Section: A Low Power Plane Modelingmentioning

confidence: 99%

An Accurate Modeling Approach to Compute Noise Transfer Gain in Complex Low Power Plane Geometries of Power Converters

Nguyen¹,

Blanchette²,

Wang³

2017

Journal of Power Electronics

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An approach based on a 2D lumped model is presented to quantify the voltage transfer gain (VTG) in power converter low power planes. The advantage of the modeling approach is the ease with which typical noise reduction devices such as decoupling capacitors or ferrite beads can be integrated into the model. This feature is enforced by a new modular approach based on effective matrix partitioning, which is presented in the paper. This partitioning is used to decouple power plane equations from external device impedance, which avoids the need for rewriting of a whole set of equation at every change. The model is quickly solved in the frequency domain, which is well suited for an automated layout optimization algorithm. Using frequency domain modeling also allows the integration of frequency-dependent devices such inductors and capacitors, which are required for realistic computation results. In order to check the precision of the modeling approach, VTGs for several layout configurations are computed and compared with experimental measurements based on scattering parameters.

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Section: A Low Power Plane Modelingmentioning

confidence: 99%

An Accurate Modeling Approach to Compute Noise Transfer Gain in Complex Low Power Plane Geometries of Power Converters

Nguyen¹,

Blanchette²,

Wang³

2017

Journal of Power Electronics

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“…A quite fast and accurate method for the approximate calculation of the PCB power-bus impedance is the modified modal summation [14], [15]. This method is based on the cavity-model for a unpopulated rectangular PB which solved the 2D-Helmholtz equation by using a series expansion of orthogonal modes [16] - [18] and leads to a double summation expression for the impedance of the populated rectangular PB:…”

Section: Impedance Of the Power-busmentioning

confidence: 99%

“…In this paper both methods are combined to account for the influence of a through-hole via on the PB impedance using a de-embedding algorithm and the two-port theory. First a known analytical approximate calculation of the PCB power-bus parallel planes structure [14], [15] is briefly described and its application as impedance matrix for further calculations is mentioned (section II). Then a via model is introduced, which allows to explain the main effects of a through-hole via inside the PB (section III-A).…”

Section: Introductionmentioning

confidence: 99%

On the influence of vias on a PCB power-bus

Heinrich

Dickmann

2008

2008 International Symposium on Electromagnetic Compatibility - EMC Europe

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In this paper, a method for the investigation of the influence of a through-hole via on a printed circuit board power-bus is presented. Therefore based on an introduced via model for a through-hole via its scattering parameters are extracted using a de-embedding algorithm. After the following calculation of the via model elements with the two-port theory, the extracted impedances are inserted in a known formula for the power-bus impedance. In addition, it is shown how the signal return current acts as an excitation source of the waveguide modes within the power-bus.

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“…as a part of so-called physics-based via models [1]. In power integrity analysis, the parallel plate impedance in itself is commonly employed to investigate problems such as simultaneous switching noise and to determine the optimal placement of decoupling capacitors [2]- [4]. The parallel plate impedance is typically defined for a homogeneous dielectric substrate between two perfect electric conductor (PEC) reference planes.…”

Section: Introductionmentioning

confidence: 99%

Effect of layered media on the parallel plate impedance of printed circuit boards

Dahl

Müller

Schuster

2014

2014 IEEE Electrical Design of Advanced Packaging &Amp; Systems Symposium (EDAPS)

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This paper evaluates the impact of layered media on the parallel plate impedance of printed circuit boards. In the parallel plate impedance computation using the radial waveguide method (RWM) for infinite planes and a contour integral method (CIM) for finite planes, the layered nature of investigated structures can be accounted for by effective wave numbers. Here, the effective wave numbers are obtained using either an exact solution from the transverse resonance method (TRM) or adopting approximations based on the assumption of quasi-TEM fields and the applicability of suitable averages. The wave numbers obtained with these techniques are compared for typical structures of interest, and the parallel plate impedance computed with effective wave numbers is evaluated and compared to a full wave solution. The results show that a comparatively simple approximation for the effective wave number is sufficient for an accurate parallel plate impedance calculation.Index Terms-parallel plate impedance, parallel plate waveguide, wave number, layered media, transverse resonance method, radial waveguide method, contour integral method

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Single Summation Expression for the Impedance of Rectangular PCB Power-Bus Structures Loaded With Multiple Lumped Elements

Cited by 27 publications

References 11 publications

An Accurate Modeling Approach to Compute Noise Transfer Gain in Complex Low Power Plane Geometries of Power Converters

An Accurate Modeling Approach to Compute Noise Transfer Gain in Complex Low Power Plane Geometries of Power Converters

On the influence of vias on a PCB power-bus

Effect of layered media on the parallel plate impedance of printed circuit boards

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