Size effects on the interfacial reaction and microstructural evolution of Sn-ball/Sn3.0Ag0.5Cu-paste/Cu joints in board-level hybrid BGA interconnection at critical reflowing temperature

Huang, Jia-Qiang; Zhou, Min-Bo; Liang, Shuibao; Zhang, X. P.

doi:10.1007/s10854-018-8758-0

Cited by 15 publications

(7 citation statements)

References 23 publications

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“…For a sufficiently high reflow temperature, the reaction in the small solder ball is stronger due to the faster melting. In the case, the Cu concentration near the interface is higher for the small solder ball, even under a long heat treatment period, which accelerates the formation and growth of IMC in solder balls with smaller size, as reported that the IMC thickness of 220 μm solder ball is about 2.6 times that of 760 μm solder ball under the same reflow conditions (Huang et al , 2018). The difference causes the deviation of their mechanical performance in the macro-level.…”

Section: Resultsmentioning

confidence: 86%

“…The strength of solder ball in a shear or pull test is closely connected with IMC, the sandwich-like structure of Sn 6 Cu 5 /Sn 3 Cu/Cu, which grows with the heat treatment process, e.g. thermal aging and multiple reflows (Gong et al , 2008; Huang et al , 2018; Kumar et al , 2011; Mu et al , 2016; Wang et al , 2012). Owing to the temperature distribution difference, the size of solder ball influences the IMC evolution via intermetallic reactions (Zhou et al , 2012).…”

Section: Resultsmentioning

confidence: 99%

“…The thickness and components of the intermetallic compound (IMC) near the interface between the solder and copper pad are critical for the interfacial strength and depend on a thermal process, such as reflows (Mu et al , 2016; Sujan et al , 2015). In a recent published work about Sn-3.0Ag-0.5Cu (by wtper cent, SAC305), the grain size and the average thickness of IMC are much larger in a smaller solder ball than in a bigger one under the same condition of reflow (Huang et al , 2018), e.g. the average IMC thickness of 220μm solder balls is raised as much as approximately 2.6 times than that of 760 μm ones after a reflow at 227°C with a dwell time of 3 min.…”

Section: Introductionmentioning

confidence: 99%

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Study on the strength of diameter-reducing solder balls by shear and pull tests

Yang

Wang

et al. 2019

SSMT

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Purpose The purpose of this paper is to study the variation of the mechanical strength and failure modes of solder balls with reducing diameters under conditions of multiple reflows. Design/methodology/approach The solder balls with diameters from 250 to 760 µm were mounted on the copper-clad laminate by 1-5 reflows. The strength of the solder balls was tested by the single ball shear test and pull test, respectively. The failure modes of tested samples were identified by combing morphologies of fracture surfaces and force-displacement curves. The stresses were revealed and the failure explanations were assisted by the finite element analysis for the shear test of single solder ball. Findings The average strength of a smaller solder ball (e.g. 250 µm in diameter) is higher than that of a larger one (e.g. 760 µm in diameter). The strength of smaller solder balls is more highly variable with multiple reflows than larger diameters balls, where the strength increased mostly with the number of reflows. According to load-displacement curves or fracture surface morphologies, the failure modes of solder ball in the shear and pull tests can be categorized into three kinds. Originality/value The strength of solder balls will not deteriorate when the diameter of solder ball is decreased with a reflow, but a smaller solder ball has a higher failure risk after multiple reflows. The failure modes for shear and pull tests can be identified quickly by the combination of force-displacement curves and the morphologies of fracture surfaces.

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Section: Resultsmentioning

confidence: 86%

Section: Resultsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Study on the strength of diameter-reducing solder balls by shear and pull tests

Yang

Wang

et al. 2019

SSMT

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“…With aging going on, the diffusion of Sn and Cu atoms were largely affected by RE Pr atoms and the shape of interfacial IMC layer remains flat, as illustrated in Figure 5(bII,III). [31] with sharp protrusions emerged after initial 72-h aging (Figure 3a). Moreover, a darker interfacial IMC layer, as identified to be Cu 3 Sn [32] also grew near the Cu substrate.…”

Section: Methodsmentioning

confidence: 99%

Effect of 0.05 wt.% Pr Addition on Microstructure and Shear Strength of Sn-0.3Ag-0.7Cu/Cu Solder Joint during the Thermal Aging Process

et al. 2019

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The evolution of interfacial morphology and shear strengths of the joints soldered with Sn-0.3Ag-0.7Cu (SAC0307) and SAC0307-0.05Pr aged at 150 • C for different times (h; up to 840 h) were investigated. The experiments showed the electronic joint soldered with SAC0307-0.05Pr has a much higher shear strength than that soldered with SAC0307 after each period of the aging process. This contributes to the doping of Pr atoms, "vitamins in alloys", which tend to be adsorbed on the grain surface of interfacial Cu6Sn5 IMCs, inhibiting the growth of IMCs. Theoretical analysis indicates that doping 0.05 wt.% Pr can evidently lower the growth constant of Cu6Sn5 (DCu6), while the growth constant of Cu3Sn (DCu3) decreased slightly. In addition, the electronic joint soldered with SAC0307-0.05Pr still has better ductility than that soldered with SAC0307, even after a 840-h aging process.

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“…The development of three-dimensional integrated circuit (3D IC) packaging technology [8,9,10,11], has caused the solder interconnect to downsize to balls of diameter lesser than 50 µm. Moreover, the Cu 6 Sn 5 IMC growth related to this size effect poses a serious reliability concern [12,13,14,15,16,17]. Any study providing relationship between solder volume and intermetallics compound, can be added in contributing for the reliability enhancement of solder joints.…”

Section: Introductionmentioning

confidence: 99%

Growth behavior of preferentially scalloped intermetallic compounds at extremely thin peripheral Sn/Cu interface

Shang

Kunwar

Wang

et al. 2019

J Mater Sci: Mater Electron

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The growth behaviour of Cu 6 Sn 5 intermetallic compound (IMC) at the solder height controlled post-spread Sn/Cu interface is investigated for different initial solder ball volumes, reflow temperatures and cooling rates. Because of the limited solder thickness at the periphery, the IMC retains a preferential scalloped morphology, even after cooling. For solder balls of initial diameters of 500, 1000 and 1700 µm, with the maximum solder height at the peripheral regime not exceeding 150 µm, reflowed at 250 ℃ and undergoing air cooling, it has been revealed that IMC characterized with larger layer thickness and grain diameter, correspond to the sample of smaller ball size. The increase in reflow temperature for a solder of initial size of 500 µm, is characterized by the increase in IMC thickness, developments of few but quite large faceted planes over the original scalloped morphology and non-uniformity in the grain diameter. In contrary the to air cooling (cooling rate 4.0 K/s), the IMCs obtained at the thin film zone, for furnace cooling (cooling rate = 0.037 K/s), are very larger, both in grain size and layer thickness. Moreover, the scalloped Cu 6 Sn 5 surface in furnace cooled specimens, bear many but tiny

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Size effects on the interfacial reaction and microstructural evolution of Sn-ball/Sn3.0Ag0.5Cu-paste/Cu joints in board-level hybrid BGA interconnection at critical reflowing temperature

Cited by 15 publications

References 23 publications

Study on the strength of diameter-reducing solder balls by shear and pull tests

Study on the strength of diameter-reducing solder balls by shear and pull tests

Effect of 0.05 wt.% Pr Addition on Microstructure and Shear Strength of Sn-0.3Ag-0.7Cu/Cu Solder Joint during the Thermal Aging Process

Growth behavior of preferentially scalloped intermetallic compounds at extremely thin peripheral Sn/Cu interface

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