2013
DOI: 10.1016/j.actamat.2013.08.002
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Small-angle subgrain boundaries emanating from dislocation pile-ups in multicrystalline silicon studied with synchrotron white-beam X-ray topography

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Cited by 44 publications
(29 citation statements)
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“…The high‐resolution electron backscatter diffraction revealed a maximum stress at the leading dislocation of 500 MPa much more than would demand for dislocation multiplication. Quite similar effect has been observed in mc‐Si ingots .…”
Section: Experimental Observations and Counter Actionssupporting
confidence: 52%
“…The high‐resolution electron backscatter diffraction revealed a maximum stress at the leading dislocation of 500 MPa much more than would demand for dislocation multiplication. Quite similar effect has been observed in mc‐Si ingots .…”
Section: Experimental Observations and Counter Actionssupporting
confidence: 52%
“…The observed microstructure in dislocations rich regions in mc-Si appears to be formed through a recovery process (rather than plastic slip) [20]. Lomer dislocations have also been identified at small-angle grain boundaries in mc-Si [21]. From reference [22], it can also be deduced that dislocations substructures might strongly depend on each grain orientation.…”
Section: Introductionmentioning
confidence: 93%
“…This suggests that dislocation clusters in elongating grains, may propagate and align into a network of small angle grain boundaries. This type of SA GB formation has also been observed in conventional mc-Si [17]. In this template grown ingot, the high density of random type GBs may suppress the propagation of dislocations between different grains, however, elongating grains do not have random GBs intersecting the dislocation propagation path, hence dislocations propagate, align and form SA GB network at later stage of growth.…”
Section: Contributed Articlementioning
confidence: 68%