“…Pillar splitting has been recently validated for bulk silicon (100) and several ceramic thin films (TiN, CrN) and composites (CrAlN/Si 3 N 4 ). 6,17,18 For some materials, e.g., hard metals and intermetallics, splitting may not be achieved by the Berkovich indenter but could possibly be induced with a sharper indenter, e.g., a cube-corner indenter. 19 To date, pillar-splitting fracture toughness measurements have been performed only using a Berkovich indenter and a fixed Poisson's ratio of 0.25, for which cohesive zone finite element modeling (CZ-FEM) has been carried out to determine the coefficient c in Equation (1).…”