Small size, low power consumption, low phasenoise MMIC VCO using off-chip packaging resonatorfor mobile communication

We present C-band oscillators with external high4 inductors: wire-bond inductors and embedded inductors in a Mum-Layer Organic (MLO) board fabricated by a thick-film MCM-L technology. The phase-noise performance of oscillators are compared with the oscillator using onship inductors. Inductors are designed to obtain high quality factor In C-band. The phase-noise performauce ofthe oscillator with onsbip Inductors measures -108 dBc/Hz at 600 KHz offset frequency, and that of the oscillator with external inductors shows -113 dBcJHz at the same offset. Using MLO inductors, the phase-noise is better than the oscillator with onship inductors and comparable to the oscillator with wirebond inductors. To our knowledge, this is the first C-band oscillator using inductors embedded in the multi-layer organic packaging technology. This is. also the first report comparing the performance of oscillators using three different inductor technologies: onsbip Integration, wire-bonding, and multi-layer orgauic packaging technology.

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C-band oscillator using high-Q inductors embedded in multi-layer organic packaging

Yoon

Davis

Lim

et al.

2002 IEEE MTT-S International Microwave Symposium Digest (Cat. No.02CH37278)

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Small size, low power consumption, low phasenoise MMIC VCO using off-chip packaging resonatorfor mobile communication

Cited by 1 publication

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C-band oscillator using high-Q inductors embedded in multi-layer organic packaging

C-band oscillator using high-Q inductors embedded in multi-layer organic packaging

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