Sn whiskers removed by energy photo flashing

Jiang, Nan; Yang, Mohshi; Novak, James P.; Igor, P Raevski; Osterman, Michael

doi:10.1016/j.apsusc.2012.05.155

Cited by 3 publications

(1 citation statement)

References 9 publications

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“…Many driving forces have been proposed in literature [11] for the surface evolution leading to whiskers, e.g., oxidation, recrystallization and residual stress [2]. Because of the danger of whisker formation, a procedure has been developed to remove the whiskers formed; however, it hides a number of risks [12]. The aim of this work is the investigation of tin whisker formation under operation conditions of electrical contacts maximally close to the real ones, i.e.…”

Section: Introductionmentioning

confidence: 99%

Studying Pressure Induced Whiskers Formation from Sn-Rich Surfaces

Sycheva

Radanyi

Gácsi

2014

MSF

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Whiskers formed on the lead-free tin surfaces pose a serious risk to small electronic devices causing a short circuit and leading to the component/device failure. The present research was focused on the investigation of tin whisker formation on a motor control unit sockets made of tin coated copper, applying to the specimen mechanical load alone or together with heat treatment/electric current. Scanning Electron Microscopic (SEM) imaging was applied in order to study the microstructure of tin whiskers obtained, their length and number at the boundary of each imprint. If the mechanical stress increases from 1000 to 5000 MPa, the average number of whiskers and possible formation spots also increase from 570 to 1300. The length of whiskers varied from 3 μm after 0.5 h to 5.5 μm after 3 hours of exposition. It has been found that heat treatment at 150°C for 1 hour significantly reduces the number of whiskers (on average 6 times as few) formed. Therefore, the threat of failure of the electronic equipment is reduced.

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Section: Introductionmentioning

confidence: 99%

Studying Pressure Induced Whiskers Formation from Sn-Rich Surfaces

Sycheva

Radanyi

Gácsi

2014

MSF

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Mechanisms behind the spontaneous growth of Tin whiskers on the Ti2SnC ceramics

Liu

Zhang

et al. 2020

Acta Materialia

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Control Al/Mg intermetallic compound formation during ultrasonic-assisted soldering Mg to Al

et al. 2018

Ultrasonics Sonochemistry

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To prevent the formation of Al/Mg intermetallic compounds (IMCs) of AlMg and AlMg, dissimilar Al/Mg were ultrasonic-assisted soldered using Sn-based filler metals. A new IMC of MgSn formed in the soldered joints during this process and it was prone to crack at large thickness. The thickness of MgSn was reduced to 22 μm at 285 °C when using Sn-3Cu as the filler metal. Cracks were still observed inside the blocky MgSn. The thickness of MgSn was significantly reduced when using Sn-9Zn as the filler metal. A 17 μm MgSn layer without crack was obtained at a temperature of 200 °C, ultrasonic power of Mode I, and ultrasonic time of 2 s. The shear strengths of the joints using Sn-9Zn was much higher than those using Sn-3Cu because of the thinner MgSn layer in the former joints. Sn whiskers were prevented by using Sn-9Zn. A cavitation model during ultrasonic assisted soldering was proposed.

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Sn whiskers removed by energy photo flashing

Cited by 3 publications

References 9 publications

Studying Pressure Induced Whiskers Formation from Sn-Rich Surfaces

Studying Pressure Induced Whiskers Formation from Sn-Rich Surfaces

Mechanisms behind the spontaneous growth of Tin whiskers on the Ti2SnC ceramics

Control Al/Mg intermetallic compound formation during ultrasonic-assisted soldering Mg to Al

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