Software for eraure simul () in electron-beam lithography

Babin, S.; Kuzmin, Igor Yu.; Sergeev, G. I.

doi:10.1016/s0167-9317(98)00043-4

Cited by 3 publications

(1 citation statement)

References 8 publications

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“…These assumptions lead to very different results: the temperature rise under identical conditions was calculated as 14°C in Ref. TEMPTATION software 13 was recently developed, based on this model. 11.…”

Section: Introductionmentioning

confidence: 99%

Experimental verification of the TEMPTATION (temperature simulation) software tool

Babin¹

1998

Journal of Vacuum Science &Amp; Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena

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Articles you may be interested inComparison between ZEP and PMMA resists for nanoscale electron beam lithography experimentally and by numerical modeling J. Vac. Sci. Technol. B 29, 06F306 (2011); 10.1116/1.3640794Pattern matching, simulation, and metrology of complex layouts fabricated by electron beam lithography Deep submicron resist profile simulation and characterization of electron beam lithography system for cell projection and direct writing Predicting the temperature rise during electron-beam lithography ͑EBL͒ is an important practical problem in the development of new EBL systems and in the optimization of new exposure processes. The TEMPTATION software tool was developed. This software uses an analytic solution of heat propagation in a multilayered substrate. The software attains both high speed and good accuracy. Experimental verification of the software was done. Simulated data were verified versus experiments made with variably shaped EBL systems using three different resists. Change of effective absorbed energy due to heating was simulated and compared to published data. Good agreement of predicted and measured data for both long-range and short-range resist heating was shown.

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Section: Introductionmentioning

confidence: 99%