2004
DOI: 10.1109/tns.2004.829540
|View full text |Cite
|
Sign up to set email alerts
|

SOI active pixel detectors of ionizing radiation-technology and design development

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
4
1

Citation Types

0
12
0

Year Published

2005
2005
2024
2024

Publication Types

Select...
5
2
1

Relationship

1
7

Authors

Journals

citations
Cited by 17 publications
(12 citation statements)
references
References 7 publications
0
12
0
Order By: Relevance
“…Developments on monolithic pixels in SOI technology can also be found on radiation applications, [6]. SOI detectors wafers are formed by bonding together a top wafer with low resistivity and a bottom wafer with high resistivity.…”
Section: Introductionmentioning
confidence: 99%
“…Developments on monolithic pixels in SOI technology can also be found on radiation applications, [6]. SOI detectors wafers are formed by bonding together a top wafer with low resistivity and a bottom wafer with high resistivity.…”
Section: Introductionmentioning
confidence: 99%
“…There are four parallel sensing diodes spaced 13 um apart in each pixel. Each pixel has a Charge Sensitive Amplifier, CR-RC 2 shaper, discriminator and a 12 bit counter as shown in Figure 2. There are 280 transistors in each pixel.…”
Section: Fermilab Soi Cmos Detectormentioning
confidence: 99%
“…SOI CMOS detectors offer larger signals with faster rise times due to depleted diode regions in the high resistivity substrate beneath the buried oxide (BOX). Early work on SOI CMOS detectors was reported by C. Penng [1], followed by J. Marczewski [2]. Recent availability of SOI CMOS in deep submicron processes has spurred new developments [3].…”
Section: Introductionmentioning
confidence: 99%
“…Leading sensor techniques are Charge Coupled Devices (CCDs) [4], Monolithic Active Pixel Sensors (MAPS) [5] and Depleted Field Effect Transistors (DEPFETs) [6]. Alternative approaches are based on the Geiger mode avalanche photodiodes (GAPDs) [7,8] and Silicon-On-Insulator (SOI) devices [9]. More recently, CMOS sensors exploiting the vertical integration technology (3D) have also gained interest [10].…”
Section: Introductionmentioning
confidence: 99%