2001
DOI: 10.1109/66.920722
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Specular spectroscopic scatterometry

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Cited by 131 publications
(16 citation statements)
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“…1,2 Since the year of around 2000, spectroscopic ellipsometry was introduced to monitor critical dimension of grating structures in semiconductor manufacturing. 3,4 Compared with scanning electron microscopy (SEM) and atomic force microscopy (AFM), this technique, also referred to as optical scatterometry or optical critical dimension metrology, has achieved wide industrial applications after decades of development due to its attractive advantages, such as low cost, high throughput, and minimal sample damage. Among the various types of ellipsometers, Mueller matrix ellipsometer (MME), also known as Mueller matrix polarimeter, can provide all 16 elements of a 4 × 4 Mueller matrix.…”
Section: Introductionmentioning
confidence: 99%
“…1,2 Since the year of around 2000, spectroscopic ellipsometry was introduced to monitor critical dimension of grating structures in semiconductor manufacturing. 3,4 Compared with scanning electron microscopy (SEM) and atomic force microscopy (AFM), this technique, also referred to as optical scatterometry or optical critical dimension metrology, has achieved wide industrial applications after decades of development due to its attractive advantages, such as low cost, high throughput, and minimal sample damage. Among the various types of ellipsometers, Mueller matrix ellipsometer (MME), also known as Mueller matrix polarimeter, can provide all 16 elements of a 4 × 4 Mueller matrix.…”
Section: Introductionmentioning
confidence: 99%
“…Nowadays, the critical dimension (CD) in integrated circuits is shrinking to 45 nm and even lower, accompanying with tremendous challenges of nanometrology. 1 The optical critical dimension (OCD) metrology, also called scatterometry, [2][3][4] is one of the well-known optical techniques that has gained considerable interest in the industrial environment because it is fast, noncontact, nondestructive, and of lowcost, compared to other techniques such as scanning electron microscopy (SEM) and atomic force microscopy (AFM). 5,6 The success of OCD metrology relies heavily on accurate forward modeling of sub-wavelength structures and fast extraction of structural parameters.…”
Section: Introductionmentioning
confidence: 99%
“…[7][8][9][10] Then in the inverse problem, the measured optical parameters are obtained and utilized to fit the simulation parameters using some library search methods or nonlinear regression algorithms. 2,11,12 The forward modeling is repeated until the required accuracy is acquired and the structural parameters are measured to provide the best fit. Because this process takes time, it is highly desirable to improve the speed of optical modeling to achieve the greatest efficiency in OCD metrology.…”
Section: Introductionmentioning
confidence: 99%
“…5,6 Instead of a blank substrate, SE spectra of a subwavelength silica grating are analyzed and the silica etch rates are deduced by tracing the changes in the nano-grating line shape. 5,6 Instead of a blank substrate, SE spectra of a subwavelength silica grating are analyzed and the silica etch rates are deduced by tracing the changes in the nano-grating line shape.…”
Section: Introductionmentioning
confidence: 99%