2022
DOI: 10.1109/tcsii.2021.3103916
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SRAM Write Assist Circuit Using Cell Supply Voltage Self-Collapse With Bitline Charge Sharing for Near-Threshold Operation

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Cited by 4 publications
(10 citation statements)
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“…As shown in Figure 3(a), the Q-node of the memory cell is tripped at a swept word line (WL) voltage range of 0.46 to 0.61 V for a supply voltage VDD of 1 V. The mean write trip points (WTP) levels are decreased with scaling the supply voltage, which indicates scaling the supply voltage makes the cell unstable and quickly accepts the changes in bit (BIT) and bit bar (BITB) lines. So, the Q-node of a memory cell is tripped at a sweep WL voltage range of 0.33 to 0.39 V for a scaled supply voltage VDD of 0.6 V. So writeability is improved by scaling the SRAM cell's supply voltage, which is done by the CCS write-assist circuit [5]. The WTP voltage occurrence levels are plotted using Monte Carlo simulation, and it was observed that all strong cell samples with high VDD occurred on the right side (at maximum trip voltage levels).…”
Section: Capacitive Charge Sharing Write-assist Circuitmentioning
confidence: 99%
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“…As shown in Figure 3(a), the Q-node of the memory cell is tripped at a swept word line (WL) voltage range of 0.46 to 0.61 V for a supply voltage VDD of 1 V. The mean write trip points (WTP) levels are decreased with scaling the supply voltage, which indicates scaling the supply voltage makes the cell unstable and quickly accepts the changes in bit (BIT) and bit bar (BITB) lines. So, the Q-node of a memory cell is tripped at a sweep WL voltage range of 0.33 to 0.39 V for a scaled supply voltage VDD of 0.6 V. So writeability is improved by scaling the SRAM cell's supply voltage, which is done by the CCS write-assist circuit [5]. The WTP voltage occurrence levels are plotted using Monte Carlo simulation, and it was observed that all strong cell samples with high VDD occurred on the right side (at maximum trip voltage levels).…”
Section: Capacitive Charge Sharing Write-assist Circuitmentioning
confidence: 99%
“…Tran-NBL write-assist circuit, shown in Figure 4(a), can improve the write performance with the help of two charging capacitors (CRBOOST and CLBOOST). One end of these capacitors is connected to the BIT line and write word line-B (WWLB) of the 9T SRAM cell, and the opposite end of the capacitors is connected to the control input 'BIT_EN', as shown in Figures 4(b) and (c) [5]. Figure 4(d) depicts the timing diagram for the circuit functioning.…”
Section: Tran-negative Bit Line (T-nbl) Write-assist Circuitmentioning
confidence: 99%
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“…Write-ability performance analysis of memory cell through the "WM" parameter and occurrence of WM for proposed BSRWA SRAM cell with reference to previous SRAM cell (SSDF SRAM cell) is observed in Figure 8. Te histogram plot of MC simulation for SSDF SRAM cell, SSDF SRAM cell with UDVS assist circuit [20,21], SSDF SRAM cell with NBL assist circuit [15], and the proposed BSRWA SRAM cell is observed in Figure 8. Te improvement of WM for SSDF SRAM cell [14] is 15.7% (WM � 0.38 V to 0.44 V) by UDVS assist circuit [20,21] and 26.1% (WM � 0.38 V to 0.484 V) by the NBL assist circuit [15].…”
Section: Write Performance Analysis Using Wm Parametermentioning
confidence: 99%
“…This restricts the minimal supply voltage (also known as V min ) scaling to achieve functional SRAM operation. One way to prevent such possible failures is to utilize circuit-assist techniques such as wordline underdrive (WLUD) [7] for read operations and supply voltage collapse (SVC) [8] and negative bitline (NBL) [9] during write operations. The aforementioned circuit-level assist solutions, on the other hand, necessitate a increment in power and area requirement, as well as a substantial increase in cycle time.…”
Section: Introductionmentioning
confidence: 99%