Stackable memory of 3D chip integration for mobile applications

Gu, Sam; Marchal, Paul Alfred; Facchini, Marco; Wang, F.; Suh, M.; Lisk, D.; Nowak, Matt

doi:10.1109/iedm.2008.4796821

Cited by 48 publications

(21 citation statements)

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“…This technology has been widely explored by academia and industry to develop high-performance system-in-package designs [33], [37]. With 3D stacking technology, we can deploy CMOS and NVM components on separate dies and vertically stack the dies on top of each other [36], [38], [39], [40], [41], [42], [43], [44], [45], [46], [47]. For instance, Samsung recently announced a 3D-stacked wide-I/O DRAM targeting mobile systems [43].…”

Section: Replacing Traditional Memory Technologies With Nvmsmentioning

confidence: 99%

Memory and Storage System Design with Nonvolatile Memory Technologies

Zhao

Chi

et al. 2015

IPSJ Transactions on System LSI Design Methodology

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Abstract:The memory and storage system, including processor caches, main memory, and storage, is an important component of various computer systems. The memory hierarchy is becoming a fundamental performance and energy bottleneck, due to the widening gap between the increasing bandwidth and energy demands of modern applications and the limited performance and energy efficiency provided by traditional memory technologies. As a result, computer architects are facing significant challenges in developing high-performance, energy-efficient, and reliable memory hierarchies. New byte-addressable nonvolatile memories (NVMs) are emerging with unique properties that are likely to open doors to novel memory hierarchy designs to tackle the challenges. However, substantial advancements in redesigning the existing memory and storage organizations are needed to realize their full potential. This article reviews recent innovations in rearchitecting the memory and storage system with NVMs, producing high-performance, energy-efficient, and scalable computer designs.

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Section: Replacing Traditional Memory Technologies With Nvmsmentioning

confidence: 99%

Memory and Storage System Design with Nonvolatile Memory Technologies

Zhao

Chi

et al. 2015

IPSJ Transactions on System LSI Design Methodology

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“…At the same time, the data transfer power consumption must be minimized to guarantee sufficient battery life. Whereas in today's system's on-chip SRAMs are used to cater to the required data rates, the integration of memories, particularly high density ones, in advanced logic chip processes may become prohibitively expensive [2]. Alternative options, such as eDRAM, are not as economical, especially when targeting densities greater than 72Mb.…”

Section: Introductionmentioning

confidence: 99%

System-level power/performance evaluation of 3D stacked DRAMs for mobile applications

Facchini

Carlson

Vignon

et al. 2009

2009 Design, Automation &Amp; Test in Europe Conference &Amp; Exhibition

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Abstract-Convergence of communication, consumer applications and computing within mobile systems pushes memory requirements both in terms of size, bandwidth and power consumption. The existing solution for the memory bottleneck is to increase the amount of on-chip memory. However, this solution is becoming prohibitively expensive, allowing 3D stacked DRAM to become an interesting alternative for mobile applications. In this paper, we examine the power/performance benefits for three different 3D stacked DRAM scenarios. Our high-level memory and Through Silicon Via (TSV) models have been calibrated on state-of-theart industrial processes. We model the integration of a logic die with TSVs on top of both an existing DRAM and a DRAM with redesigned transceivers for 3D. Finally, we take advantage of the interconnect density enabled by 3D technology to analyze an ultra-wide memory interface. Experimental results confirm that TSV-based 3D integration is a promising technology option for future mobile applications, and that its full potential can be unleashed by jointly optimizing memory architecture and interface logic.

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“…7 The current mobile revolution has enabled applications with more data bandwidth, more sensing, faster response, more process power, and smaller form factor. The benefi ts of 3D ICs are attractive, yet many materials challenges need to be addressed.…”

Section: In This Issuementioning

confidence: 99%