Standard and self-sustained magnetron sputtering deposited Cu films investigated by means of AFM and XRD

Wiatrowski, A.; Posadowski, Witold; Jóźwiak, Grzegorz; Serafińczuk, J.; Szeloch, R.; Gotszalk, Teodor

doi:10.1016/j.microrel.2011.02.024

Cited by 7 publications

(4 citation statements)

References 10 publications

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“…Because of this, the average discharge power is at the level typical of standard sputtering processes and therefore a standard magnetron can still be used. Unfortunately, the sequential ignition and decay of the sputtering discharge reduce the deposition rate of the films [7,8]. This reduction is the result of three main factors [7,9]: (i) high target power density during the individual sputtering pulse that creates conditions for the occurrence of the self-sputtering phenomenon, (ii) the sputtering yield does not scale linearly with the cathode voltage, and (iii) the sputtering of the cathode stops between pulses.…”

Section: Introductionmentioning

confidence: 99%

Comparison of the Physicochemical Properties of TiO2 Thin Films Obtained by Magnetron Sputtering with Continuous and Pulsed Gas Flow

et al. 2018

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In this paper, a comparison of TiO2 thin films prepared by magnetron sputtering with a continuous and pulsed gas flow was presented. Structural, surface, optical, and mechanical properties of deposited titanium dioxide coatings were analyzed with the use of a wide range of measurement techniques. It was found that thin films deposited with a gas impulse had a nanocrystalline rutile structure instead of fibrous-like anatase obtained with a continuous gas flow. TiO2 thin films deposited with both techniques were transparent in the visible wavelength range, however, a much higher refractive index and packing density were observed for coatings deposited by the pulsed gas technique. The application of a gas impulse improved the hardness and scratch resistance of the prepared TiO2 thin films.

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Section: Introductionmentioning

confidence: 99%

Comparison of the Physicochemical Properties of TiO2 Thin Films Obtained by Magnetron Sputtering with Continuous and Pulsed Gas Flow

et al. 2018

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“…Three peaks at 43.4°, 50.5°, and 74.3°, which corresponded to the (111), (200) and (220) planes of copper (JCPDS card no. 04-0836), were observed for the sputtered composites, which indicated that the thin copper film was deposited onto the composite interlayer surface (Wiatrowski et al 2011). The chemical compositions of the magnetic composites were analyzed via FTIR and XPS (Fig.…”

Section: Characterizations Via Sem Eds Xrd Ftir and Xpsmentioning

confidence: 99%

Natural fiber-based composites with high hydrophobic, magnetic, and EMI shielding properties via iron oxide in situ synthesis and copper film deposition

Wang

Tang

Xiao

et al. 2020

BioRes

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A sandwich-structured natural fiber-based magnetic composite, without the use of a binder, was developed in this study. It was fabricated via in situ synthesis, densification, and magnetron sputtering processes. The chemical composition, crystal structure, microstructure, and thermal stability were characterized via X-ray photoelectron spectroscopy, energy-dispersive spectroscopy, X-ray diffraction, scanning electron microscope, and thermogravimetric analysis. The hydrophobic, magnetic, and electromagnetic interference shielding properties were investigated by measuring the static water contact angle, the magnetic hysteresis loops, and the shielding effectiveness. The resulted composites exhibited a unique inner structure with a larger iron oxide size and content (492 nm and 26.1 wt%) on the interlayer surface in comparison to the core layer (135 nm and 18.7 wt%). The magnetic response can be controlled by the loaded iron oxide content and the copper film deposition. Sputtering copper film changed the surface free energy, and created rough micro-/nanostructures, which yielded a highly hydrophobic nature (133° in water contact angle), and approximately 99.2% of the electromagnetic energy was shielded by the 0.8 mm thick composite.

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“…The electrical resistivity and mechanical properties of Cu films are important factors for its use as interconnecting material. Magnetron sputtering has become one of commonly used techniques for industrial deposition of thin films and coatings, due to its simplicity and reliability [5]. Generally, structure and electrical qualities of films strongly depend on the deposition process [6].…”

Section: Introductionmentioning

confidence: 99%

“…Properties such as stress, texture, and morphology are of key importance for predicting the reliability of thin film systems. The influence of the magnetron source operation mode (standard or self-sustained), as well as the type of power (DC, medium frequency, or pulsed DC) on the microstructure, and surface morphology of the copper thin films have been reported [5]. Sputtering DC power affected the structural features, electrical properties, and the nucleation and growth of Cu films during the initial stage of sputtering [6].…”

Section: Introductionmentioning

confidence: 99%

Effect of Annealing on Microstructure and Mechanical Properties of Magnetron Sputtered Cu Thin Films

2015

Advances in Materials Science and Engineering

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Cu thin films were deposited on Si substrates using direct current (DC) magnetron sputtering. Microstructure evolution and mechanical properties of Cu thin films with different annealing temperatures were investigated by atomic force microscopy (AFM), X-ray diffraction (XRD), and nanoindentation. The surface morphology, roughness, and grain size of the Cu films were characterized by AFM. The minimization of energy including surface energy, interface energy, and strain energy (elastic strain energy and plastic strain energy) controlled the microstructural evolution. A classical Hall-Petch relationship was exhibited between the yield stress and grain size. The residual stress depended on crystal orientation. The residual stress as-deposited was of tension and decreased with decreasing of (111) orientation. The ratio of texture coefficient of (111)/(220) can be used as a merit for the state of residual stress.

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Standard and self-sustained magnetron sputtering deposited Cu films investigated by means of AFM and XRD

Cited by 7 publications

References 10 publications

Comparison of the Physicochemical Properties of TiO2 Thin Films Obtained by Magnetron Sputtering with Continuous and Pulsed Gas Flow

Comparison of the Physicochemical Properties of TiO2 Thin Films Obtained by Magnetron Sputtering with Continuous and Pulsed Gas Flow

Natural fiber-based composites with high hydrophobic, magnetic, and EMI shielding properties via iron oxide in situ synthesis and copper film deposition

Effect of Annealing on Microstructure and Mechanical Properties of Magnetron Sputtered Cu Thin Films

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