2012
DOI: 10.1109/tns.2012.2223761
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Statistical Analysis of Heavy-Ion Induced Gate Rupture in Power MOSFETs—Methodology for Radiation Hardness Assurance

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Cited by 18 publications
(6 citation statements)
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“…3a and 3b show fluence to failure for 15 samples of two 100 V power MOSFETs. [13] While the ST-Micro HG0K failure fluences trend exponentially, the Fujitsu 2SK4219 seems to have excess early failures. Are the excesses significant?…”
Section: Destructive Seementioning
confidence: 99%
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“…3a and 3b show fluence to failure for 15 samples of two 100 V power MOSFETs. [13] While the ST-Micro HG0K failure fluences trend exponentially, the Fujitsu 2SK4219 seems to have excess early failures. Are the excesses significant?…”
Section: Destructive Seementioning
confidence: 99%
“…These factors have increased interest in reliable destructive SEE rate estimation. [9][10][11][12][13] Such methods usually require estimation of at least the σ lim for failure or of σ vs. LET. Fig.…”
Section: Destructive Seementioning
confidence: 99%
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“…In order to quantify the impact of heavy ion irradiation on the reliability of unbiased devices and devices biased inside their SOA an accelerated reliability standard method namely Constant Voltage Stress (CVS) was used [18]. The use of statistical methods for assessing heavy ion impact on device's sensitivity has appeared recently to be of interest in the field of radiation hardness assurance [11], [14], [19]- [21]. TDDB measurements are performed over time periods (less than 30 kseconds) by applying a constant voltage equal to 44 V on the gate oxide with source and drain grounded (i.e., V ).…”
Section: Post Radiation Lifetime Degradation and Latent Defectsmentioning
confidence: 99%