1997
DOI: 10.1070/qe1997v027n01abeh000812
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Statistical analysis of phase locking of optically coupled lasers with external injection of low-noise radiation

Abstract: It is necessary to develop a fast and inexpensive fabrication process of vertical electric wiring by through-silicon via (TSV) technology for advanced three-dimensional semiconductor devices. In this research, a fast-forming conductive composite was successfully developed by simultaneous deposition of conductive organic polymer (polypyrrole) and metal (silver) from the liquid phase, accelerated by photoirradiation. The growth rate of the composite was 38 nmÁs À1 , which is more than 10 times higher than that o… Show more

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Cited by 4 publications
(1 citation statement)
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“…The principle of the regenerative amplification of the picosecond USP is already realized in an injection seeding method [1][2][3][4]. Developed nowadays by some authors this method allows to be approximated to creation of the powerful compact laser source of pico-and femtosecond range.…”
Section: Introductionmentioning
confidence: 99%
“…The principle of the regenerative amplification of the picosecond USP is already realized in an injection seeding method [1][2][3][4]. Developed nowadays by some authors this method allows to be approximated to creation of the powerful compact laser source of pico-and femtosecond range.…”
Section: Introductionmentioning
confidence: 99%