Stencil evaluation of ultra fine pitch solder paste printing process

Yang, Jimmy; Huang, Jay; Lee, Vincent; Tsai, Jojo; Ku, J. L.; Li, K. C.; Hsieh, Ander; Chen, Cheng-Yu

doi:10.1109/impact.2010.5699642

Cited by 3 publications

(2 citation statements)

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“…With this level of accuracy, misalignment almost never occurs as the smallest distance between solder paste prints is 0.25mm, unless in an improper set-up during model changeover. Based on prior defect statistics, 50-60% of defects which occurred at PCB assembly is due to stencil printing, and these figures are well within the estimates from industry standards of 50-70% (Jianbiao et al, 2004;Yang et al, 2010;Zhang et al, 2007). Since all parameters for the process are already standardised through prior experimentation for the specified product family and programmed into the stencil printer machine computer, the issue was perplexing in the beginning, but the target of ZD became visible when the crews were empowered with knowledge from the mobile learning app.…”

Section: Building Information Blocks For Process Modelsupporting

confidence: 70%

An interactive mobile learning application using machine learning framework in a flexible manufacturing environment

Siew

Low

Teoh

2016

IJMLO

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A mobile learning program was initiated in a manufacturing facility 'MF' that supports customer orders from regions of Asia Pacific, Europe, and Middle East. The area of focus is in stencil printing process, with the objective of achieving zero defects. The challenge is to deliver clear, concise, and actionable information in order to empower three crews that work 24 hours every working day for continuous improvement. Using R statistical software to process information downloaded from Oracle database and an artificial neural network algorithm to learn the characteristics of the stencil printing process, an Android app was created as user interface in a mobile device which delivers the information in a form of a colour coded square matrix, introduced as ISN (inferior-superior-neutral) matrix. This approach resulted in dramatic process improvements in crews that are empowered with knowledge towards achieving the goal of zero defect manufacturing.

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Section: Building Information Blocks For Process Modelsupporting

confidence: 70%

An interactive mobile learning application using machine learning framework in a flexible manufacturing environment

Siew

Low

Teoh

2016

IJMLO

View full text Add to dashboard Cite

show abstract

“…Stencil evaluation of ultra fine pitch solder paste printing process [91] Collaboration works in China between Wistron Corp., and National Taipei University of Technology.…”

Section: Title Authors Remarksmentioning

confidence: 99%

Review on Corrosion in Electronic Packaging Trends of Collaborative between Academia–Industry

2022

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This article reviews corrosion in electronic packaging mainly in the semiconductor industry over the world. The previous study was reviewed scientifically to highlight the significant work on corrosion in electronic packaging. A total of 467 and 762 studies were found in the IEEE Explore and Scopus databases from 2010 to 2020, respectively. After the search was limited to articles and proceedings, the databases showed only 319 from IEEE and 694 from Scopus. The keywords searching for this topic also emphasized corrosion wire bonding, corrosion leadframe, and corrosion solder. When searching for articles and proceedings were divided into three (3) categories such as academia, industry, and collaborative works, the database from collaborative works showed only 57 and 108 results in IEEE and Scopus, respectively. The studies were classified according to the process after some analysis using Microsoft Excel. Most of the previous studies were on corrosion in electronic packaging. From the study, we found that most of the journal articles were published by academia while the proceeding was published by industry. This information was extracted from IEEE Explore and Scopus databases. Since 2010, the trend of collaborative works among the industry and academia showed increased from 13 to 165 total publications in 2020. This review is significant to give an overview of the collaborative works between industry and academia on the corrosion issue in electronic packaging.

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Comprehensive correlation of inline inspection data for the evaluation of defects in heterogeneous electronic assemblies

Härter

Klinger

Franke

et al. 2016

2016 Pan Pacific Microelectronics Symposium (Pan Pacific)

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Stencil evaluation of ultra fine pitch solder paste printing process

Cited by 3 publications

References 1 publication

An interactive mobile learning application using machine learning framework in a flexible manufacturing environment

An interactive mobile learning application using machine learning framework in a flexible manufacturing environment

Review on Corrosion in Electronic Packaging Trends of Collaborative between Academia–Industry

Comprehensive correlation of inline inspection data for the evaluation of defects in heterogeneous electronic assemblies

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