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Octadecaborane (B 18 H 22 ) implant technology was evaluated for p+ poly gate doping process in a 72nm node stack DRAM device. The evaluation criteria were to improve the productivity of the process, which was initially built with conventional atomic boron implantation ( 11 B), while maintaining process equivalency. Before implanting into device wafers, process matching to conventional boron implant was done using both crystalline silicon and poly-silicon on Si wafers. For the crystalline silicon wafers, the R s of blanket B 18 H X + implants were compared to that of atomic boron. For the poly-Si silicon wafers, SIMS dopant profiles were compared. For the device wafers, boron penetration, gate depletion, and final yield were compared. In addition, B 18 H 22 implant splits of various energies and doses have been studied for their sensitivities to the electrical performance of the p-MOSFET in the 72nm node stack DRAM devices. In this study, we have demonstrated that B 18 H 22 can provide up to 5X wafer throughput advantage over conventional atomic boron process due to much higher effective beam currents. Besides the significant productivity improvement, B 18 H 22 implant device characteristics were well matched to the baseline atomic boron process.

This research is to integrate the QFD and TRIZ theories into innovative principles of the intelligent patient bed design processes. The use of the QFD matrix expansion and its importance for the evaluation and analysis to build the front-end preventive design process will meet customer needs. The evaluation is based on the order of importance; the quality characteristics of the target specifications and quality characteristics of the correlation matrix. The design of an integrated sensor system to monitor patients‟ body movements while lying on beds enables the data quantity to be collected and analyzed to identify the cause of bed sores and the spots that bed sores are prone to occur. Armed with this information, designers and engineers can work to develop much-improved and market competitive products, which is the focal point of this article. Doctors can then treat patients more efficiently and effectively. All physical response data derived from the patients (testers) are documented to assess the correlations between the sensors and the human body. During the test time, the mechanism was activated, and all of which were able to effectively facilitate the reduction of bed sores for the patient by the intelligent patient bed.

For the ultra fine pitch applications, solder paste printing acts as one of the most critical step in the SMT assembly process. A review of literature indicates that solder paste printing contributes around 60% of the total process defects. One of the key factors for the performance of solder paste deposition is stencil fabrication quality.

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