Strain-dependent electrical resistance of tin-doped indium oxide on polymer substrates

Cairns, Darran R.; Witte, Richard P.; Sparacin, Daniel K.; Sachsman, Suzanne M.; Paine, David C.; Crawford, Gregory P.; Newton, R. R.

doi:10.1063/1.126052

Cited by 593 publications

(390 citation statements)

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“…Weibull statistics on subcritical crack growth in dynamic and static fatigue tests to Eq. (13). The failure probability is obtained from Eq.…”

Section: A Electrical Resistance Increase In Dynamic and Static Fatimentioning

confidence: 99%

“…[5][6][7] As reported in literature, stressinduced cracking is the dominant reason for mechanical failure in barrier layers and subsequent device degradation. The cracking phenomenon is influenced by many factors, such as defect size and location, 5,7-9 internal stress, 10,11 layer thickness, 12,13 and loading type. 11,14 It is important to indicate that crack extension in barrier layers is greatly affected by environmental conditions, due to the fact that the brittle inorganic material is susceptible to environmentally assisted subcritical crack growth.…”

Section: Introductionmentioning

confidence: 99%

“…10,12 Another method, which is called electro-fragmentation, combines optical and electrical measurements to observe mechanical failure of conductive inorganic films on a polymer substrate. 13 In this method, the continuous electrical resistance measurement identifies the critical failure for unstable growing cracks. However, the electrical resistance measurement restrains the observation to conductive films.…”

Section: Introductionmentioning

confidence: 99%

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Subcritical crack growth in SiNx thin-film barriers studied by electro-mechanical two-point bending

Guan

Lavèn

Bouten

et al. 2013

Journal of Applied Physics

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Mechanical failure resulting from subcritical crack growth in the SiNx inorganic barrier layer applied on a flexible multilayer structure was studied by an electro-mechanical two-point bending method. A 10 nm conducting tin-doped indium oxide layer was sputtered as an electrical probe to monitor the subcritical crack growth in the 150 nm dielectric SiNx layer carried by a polyethylene naphthalate substrate. In the electro-mechanical two-point bending test, dynamic and static loads were applied to investigate the crack propagation in the barrier layer. As consequence of using two loading modes, the characteristic failure strain and failure time could be determined. The failure probability distribution of strain and lifetime under each loading condition was described by Weibull statistics. In this study, results from the tests in dynamic and static loading modes were linked by a power law description to determine the critical failure over a range of conditions. The fatigue parameter n from the power law reduces greatly from 70 to 31 upon correcting for internal strain. The testing method and analysis tool as described in the paper can be used to understand the limit of thin-film barriers in terms of their mechanical properties.

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“…Weibull statistics on subcritical crack growth in dynamic and static fatigue tests to Eq. (13). The failure probability is obtained from Eq.…”

Section: A Electrical Resistance Increase In Dynamic and Static Fatimentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Subcritical crack growth in SiNx thin-film barriers studied by electro-mechanical two-point bending

Guan

Lavèn

Bouten

et al. 2013

Journal of Applied Physics

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show abstract

“…The conventional transparent and conductive thin films, such as indium tin oxide (ITO), are brittle. When deposited on flexible substrates, the conductivity of those thin film electrodes tends to deteriorate significantly after subjecting to thermal and/or mechanical strain [1][2][3]. For instance, Na et al [1] found that the resistance of ITO on Polyethylene Terephthalate (PET), increased by ∼40 times after ∼ 2500 bending cycles at a radius of ∼8 mm.…”

mentioning

confidence: 99%

Highly conductive and transparent carbon nanotube composite thin films deposited on polyethylene terephthalate solution dipping

et al. 2010

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“…The simultaneous measurement of electrical resistance was useful to identify the critical strain for unstable crack growth, related to overall functional failure of the device. It was also used to analyze the interplay between the defect population and the geometry of patterned ITO layers on critical failure [8,9]. A similar approach was used to study the appearance of micro-cracks and related failure mechanisms in thin Cu films on polyimide (PI) substrates [10,11].…”

Section: Introductionmentioning

confidence: 99%

Electro-Fragmentation Analysis of Dielectric Thin Films on Flexible Polymer Substrates

et al. 2007

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An electro-fragmentation method was developed as a fast alternative to the time consuming fragmentation test carried out in situ in a microscope, to investigate the failure of dielectric inorganic coatings on polymer substrates. An ultrathin conductive layer was used to probe the onset of tensile failure in the dielectric coating through changes of its electrical resistance. A careful selection of the conductive layer has been carried out to avoid artifacts resulting for instance from a change of the cohesive properties (e.g. internal stress state) of the investigated structures. Au layers were found to be too ductile, contrary to Al-Ti layers that were too brittle, which invalidated the use of both materials to probe the failure of the dielectric coatings. In contrast, for structures on high-temperature polymer substrates, a 10 nm thick amorphous graphite (a-G) layer was found to accurately reproduce the cracking of the coating. The Young's modulus and coefficient of thermal expansion of the a-G layer are low enough not to impact the internal strain, hence the crack onset strain of the dielectric coating. The a-G layer is also sufficiently brittle, and its cohesive failure and resulting increase of electrical resistance is triggered by the failure of the dielectric coating. The a-G electro-fragmentation method is presently limited to polymers substrates with a glass-transition temperature higher than 100°C.

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Strain-dependent electrical resistance of tin-doped indium oxide on polymer substrates

Cited by 593 publications

References 4 publications

Subcritical crack growth in SiNx thin-film barriers studied by electro-mechanical two-point bending

Subcritical crack growth in SiNx thin-film barriers studied by electro-mechanical two-point bending

Highly conductive and transparent carbon nanotube composite thin films deposited on polyethylene terephthalate solution dipping

Electro-Fragmentation Analysis of Dielectric Thin Films on Flexible Polymer Substrates

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