Strength and reliability of low temperature transient liquid phase bonded Cu Sn Cu interconnects

Recent Progress in Transient Liquid Phase and Wire Bonding Technologies for Power Electronics

“…They reported high heat-resistant joints characteristic of Cu-Sn IMCs and dispersed Cu particles, even at a temperature of 250 • C within 20 min. Brincker et al [71] studied the reliability of Cu/Sn/Cu through low-temperature TLP bonding at 255 • C for 5 min at 25 MPa. The microstructural and optical microscopy studies of the samples revealed good homogeneity with a significant reduction in the pore density at the interface.…”

“…The strengths of powder type solders are in the range between 20 and 40 MPa. Most of the foil type solders provide strength from approximately 20 to 35 MPa [69][70][71]95]. However, the use of ultrasonic energy has been shown to improve shear strength considerably.…”

Transient Liquid Phase Bonding of Copper Using Sn Coated Cu MWCNT Composite Powders for Power Electronics

“…During the joining process, as the temperature reaches 232°C, Sn coated on the Cu-MWCNT melts and reacts with copper to form Cu-Sn IMC. At the interface of Sn and Cu-MWCNT, Cu3Sn forms according to Equation (2), whereas in Sn rich regions (surface of Figure 5b [7,9,10,[25][26][27][28][29][30][31][32]. Microstructural aspects such as the type and dispersion of second phase particles play an important role in the mechanical property of the joint.…”

Study of Cu-Sn-In system for low temperature, wafer level solid liquid inter-diffusion bonding

“…Successful SLID bonds utilizing the Cu-Sn system have been carried out at temperatures close to 300ºC [4][5][6][7][8][9][10]. Additionally, several other binary material systems like, Ag-In [11][12][13], Au-In [14][15][16], Cu-In [17], Ag-Sn [18,19], Ni-Sn [20,21] and Au-Sn [22][23][24][25][26][27][28][29] have also been demonstrated potential for SLID bonding.…”