2014
DOI: 10.1007/978-3-319-03002-9_139
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Stress Induced Degradation in Sputtered ZrO2 Thin Films on Silicon for Nano-MOSFET’s

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Cited by 4 publications
(4 citation statements)
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“…The switching from oxidizing to reducing ambient, namely nitrogen ambient, has succeeded in inhibiting the formation of SiO 2 interfacial layer as the nitrogen species diffusing to the interface could limit further oxidation at the interface by oxygen species 17,32 . A similar effect was also reported for ZrO 2 passivation layer subjected to annealing in nitrogen ambient, wherein passivating the Si dangling bonds by nitrogen species has restrained the formation of interfacial layer 33‐35 . In addition, a strong Si‐N bonding as well as relaxation of strained bonds between the CeO 2 passivation layer and Si surface could be realized through the utilization of nitrogen ambient that led to a reduction in interface trap density 36 .…”
Section: Introductionmentioning
confidence: 72%
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“…The switching from oxidizing to reducing ambient, namely nitrogen ambient, has succeeded in inhibiting the formation of SiO 2 interfacial layer as the nitrogen species diffusing to the interface could limit further oxidation at the interface by oxygen species 17,32 . A similar effect was also reported for ZrO 2 passivation layer subjected to annealing in nitrogen ambient, wherein passivating the Si dangling bonds by nitrogen species has restrained the formation of interfacial layer 33‐35 . In addition, a strong Si‐N bonding as well as relaxation of strained bonds between the CeO 2 passivation layer and Si surface could be realized through the utilization of nitrogen ambient that led to a reduction in interface trap density 36 .…”
Section: Introductionmentioning
confidence: 72%
“…17,32 A similar effect was also reported for ZrO 2 passivation layer subjected to annealing in nitrogen ambient, wherein passivating the Si dangling bonds by nitrogen species has restrained the formation of interfacial layer. [33][34][35] In addition, a strong Si-N bonding as well as relaxation of strained bonds between the CeO 2 passivation layer and Si surface could be realized through the utilization of nitrogen ambient that led to a reduction in interface trap density. 36 Similar findings have been revealed for HfO 2 37 as well as stacking CeO 2 /La 2 O 3 38 passivation layer subjected to nitridation, wherein an enhancement in carrier mobility as well as stable threshold voltage were established for the fabricated devices.…”
Section: Introductionmentioning
confidence: 99%
“…Thin films are layer of material supported on other material, known as substrate. The property of thin film is determined by stoichiometric proportion, lattice mismatch [ 163 , 164 , 165 , 166 ], nature of growth [ 167 ] and stress developed film substrate [ 168 ]. Thus, numerous methods have been developed to grow thin films of MgO by researchers, which are discussed in recent work from our group and summarized as below.…”
Section: Thin Filmsmentioning
confidence: 99%
“…Deposition methods play important role in determining the properties of thin films. The properties of thin films are determined by stoichiometric proportion, lattice mismatch (Hu et al, 2010;Gazquez et al, 2013;Loureiro et al, 2014), nature of growth (Wu et al, 2014), stress developed at film substrate interface (Rao et al, 2014). Hence, number of methods are developed to deposit thin films to get control over these parameters.…”
Section: Introductionmentioning
confidence: 99%