2007
DOI: 10.1016/j.apsusc.2006.09.041
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Stress-induced leakage currents of the RF sputtered Ta2O5 on N-implanted silicon

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Cited by 9 publications
(1 citation statement)
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“…Many annealing techniques, such as the use of dry oxygen, ultraviolet-generated ozone and plasma, and two-step process of rapid thermal annealing for crystallization of tantalum oxide films, have been used [5,6]. Different thin film deposition methods such as pulsed laser deposition, chemical vapor deposition, ion beam evaporation, and DC/RF sputtering [7][8][9][10][11][12] were employed for the preparation of tantalum oxide films. In this investigation, an attempt is made in the preparation of tantalum oxide films on quartz and silicon substrates held at room temperature (303 K) by DC magnetron sputtering technique.…”
Section: Introductionmentioning
confidence: 99%
“…Many annealing techniques, such as the use of dry oxygen, ultraviolet-generated ozone and plasma, and two-step process of rapid thermal annealing for crystallization of tantalum oxide films, have been used [5,6]. Different thin film deposition methods such as pulsed laser deposition, chemical vapor deposition, ion beam evaporation, and DC/RF sputtering [7][8][9][10][11][12] were employed for the preparation of tantalum oxide films. In this investigation, an attempt is made in the preparation of tantalum oxide films on quartz and silicon substrates held at room temperature (303 K) by DC magnetron sputtering technique.…”
Section: Introductionmentioning
confidence: 99%