We proposed a high-k metal-oxide insulator oxide-silicon-type structure with a PrTi x O y nanocrystal layer grown on the tunneling oxide of a memory device using reactive radio frequency sputtering. We found that the PrTi x O y nanocrystal film annealed at 800°C exhibited a large memory window of 3.2 V in the capacitance-voltage curve and good data retention up to 10 4 s ͑only a 5 and 10% charge loss at 25 and 85°C, respectively͒ due to deep trapping in the PrTi x O y layer. This phenomenon is attributed to a well-crystallized PrTi x O y structure and the decrease of the Pr-silicate thickness observed by X-ray diffraction and X-ray photoelectron spectroscopy, respectively.The floating-gate ͑FG͒ nonvolatile semiconductor memory ͑or flash memory͒ was first introduced by Kahng and Sze in 1967. 1 Today the flash memory device structure continues to be the most prevailing nonvolatile-memory implementation and is widely used in both standalone and embedded memories. Conventional FG memory used a polysilicon film as a charge-storage layer surrounded by the dielectric. 2 When the tunnel oxide thickness is scaled below 80 Å, the storage charge in the FG is easily lost because defects form in the tunneling oxide after repeated program-erase cycles or through direct tunneling of the current. Therefore, there is a trade-off between speed and reliability for the optimal thickness of tunnel oxide. Several methods have been investigated to overcome this oxide quality limit of the conventional FG structure. [3][4][5] To solve the issue of scaling FG memory devices while keeping the basic operating principle of memory, a distributed charge storage approach including nanocrystal memory has been proposed. 6-8 Nanocrystal memories exhibit better charge retention and lower power consumption than do FG memories that have a thinner tunneling oxide layer. As a result, a single defect in the tunneling oxide does not lead to the discharge of the memory cell.High-k materials such as the charge-trapping layer have attracted particular attention for flash memories because they possess high dielectric constants, large band offset with the tunneling oxide, and many trapping sites. 9,10 Recently, we showed that thin praseodymium oxides are promising candidates for highly scaled gate insulators, displaying a lower interfacial density of state and smaller stress-induced leakage current. 11 In addition, it has been reported 12 that an amorphous PrTi x O y deposited on the Si by E-beam evaporation exhibited excellent electrical and physical properties. In this paper, we explore a high-k PrTi x O y nanocrystal film as the chargetrapping layer deposited on the tunneling oxide of memory devices using reactive radio frequency ͑rf͒ sputtering. Crystalline structure and film morphology, and chemical binding status upon rapid thermal annealing ͑RTA͒, were explored through the use of a combination of X-ray diffraction ͑XRD͒, atomic force image microscopy ͑AFM͒, and X-ray photoelectron spectroscopy ͑XPS͒. Finally, the effects of annealing on the electrical ...