2000
DOI: 10.1002/1096-9918(200008)30:1<514::aid-sia760>3.0.co;2-k
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Structure of epitaxial Gd2O3 films and their registry on GaAs(100) substrates

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Cited by 6 publications
(6 citation statements)
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“…In addition, the ͑001͒ plane of the Gd 2 O 3 cell is parallel to the (01 1) plane of the GaAs substrate. 1,2,6 The total area of the sample surface investigated here, exposing the ͑110͒ plane of Gd 2 O 3 , is approximately 7ϫ7 mm 2 . The samples were fabricated and exposed to air for several months before insertion into vacuum.…”
mentioning
confidence: 99%
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“…In addition, the ͑001͒ plane of the Gd 2 O 3 cell is parallel to the (01 1) plane of the GaAs substrate. 1,2,6 The total area of the sample surface investigated here, exposing the ͑110͒ plane of Gd 2 O 3 , is approximately 7ϫ7 mm 2 . The samples were fabricated and exposed to air for several months before insertion into vacuum.…”
mentioning
confidence: 99%
“…Consequently, Gd 2 O 3 films in this structure are arranged in an epitaxial orientation with the ͑100͒ surface of the GaAs substrate. 2,6 It is essential that the layer be disordered all the way to the interface upon ion bombardment. Only then does the substrate influence the growth of a passivation layer with fourfold-symmetry, as observed.…”
mentioning
confidence: 99%
“…1,6 The cubic ␣-Gd 2 O 3 films, with a lattice constant of 10.81 Å, showed a crystallographic alignment of the film normal ͑110͒ parallel to GaAs͑100͒ surface normal. [8][9][10] When the Gd 2 O 3 growth rate was slowed, a new reflection high-energy electron diffraction ͑RHEED͒ pattern was observed, which showed an in-plane symmetry of fourfold, rather a usual symmetry of twofold in the cubic ␣-Gd 2 O 3 ͑110͒. These cubic ␣-phase films were fully strained below a critical thickness of about 30 Å.…”
Section: Introductionmentioning
confidence: 99%
“…One of the topics of interest is to develop a practical technique for depositing high-quality gate oxide of the devices as that in the case of Si-based devices. A number of dielectrics such as Al 2 O 3 [1], SiO 2 [2] and Gd 2 O 3 [3] have been used as a gate oxide in the MOS structures. However, these dielectrics were deposited externally on the semiconductor surface, and hence the properties of the formed oxide/semiconductor 3 Author to whom any correspondence should be addressed.…”
Section: Introductionmentioning
confidence: 99%