Studies on the electrodeposition of tin from acidic chloride–gluconate solutions

Rudnik, Ewa; Włoch, Grzegorz

doi:10.1016/j.apsusc.2012.11.130

Cited by 29 publications

(18 citation statements)

References 21 publications

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“…A gelatin colloid is often used as an inhibitor in the electrodeposition of metals; namely, copper [23], tin [7], silver [24], and zinc [25]. Sodium gluconate is a non-corrosive, non-toxic, biodegradable, and renewable additive to electroplating baths and can be successfully used for the electrodeposition of heavy metals and alloys [15,16,18,[26][27][28]. It shows excellent chelating power to many metals and can form stable complexes not only in alkaline and concentrated alkaline solutions but also in acidic electrolytes.…”

Section: Resultsmentioning

confidence: 99%

“…Among them are grain refiners (e.g., aldehydes, thiourea, PEG decyl glucoside, gelatin, peptone) [4][5][6][7], brighteners (e.g., Triton X-100, formaldehyde) [5,8,9], levelling additives (e.g., sesame oil, aromatic carbonyl compounds) [10][11][12], and complexing compounds (e.g., citrate, gluconate, tartrate) [13][14][15][16] were examined. The influence of bath constituents on the course of the early stages of tin electrodeposition and the kinetics of Sn(II) ion reduction was also discussed in some papers [15][16][17][18][19][20][21], as it shows a great influence on the further growth of the metal layer. In turn, Sharma et al [22] showed that the morphology of tin deposits can also be modified by the proper selection of current density, duty cycle, and frequency during pulsed current electrodeposition.…”

Section: Introductionmentioning

confidence: 99%

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Effect of Organic Additives on Electrodeposition of Tin From Acid Sulfate Solution

Rudnik

Chowaniec

2018

mafe

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Basic electrochemical experiments on the kinetics of tin deposition from an acid sulfate solution containing organic additives were performed. The measurements showed that tin deposits with activation polarization in a narrow potential range. Organic additives like gelatin and β-naphtol inhibit the charge transfer stage of the cathodic reaction due to the formation of adsorption layers. In turn, the gluconate ions increase the rate of tin deposition due to the bonding of hydrogen ions and inhibiting hydrogen coevolution. This results in serious changes in the morphology of tin deposits from isolated polyhedron crystals (no additive) via rectangular plates (β-naphtol) and thin plates (sodium gluconate) to rounded grains (gelatin).

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Section: Resultsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Effect of Organic Additives on Electrodeposition of Tin From Acid Sulfate Solution

Rudnik

Chowaniec

2018

mafe

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“…Chili and its food products usually contain additives and chemical substances, such as K + , Zn 2+ , Na + , Cu 2+ , glucose and fructose [32]. These compounds can possibly disturb the electrooxidation of capsaicin.…”

Section: Electrochemical Determination Of Interferencementioning

confidence: 99%

“…It is possible for tin to form a key part of active site, either purely as a coordination site or indeed as part of the redox system. Furthermore, tin has been used as a catalyst due to its high selectivity and performance to facilitate electron transfer between electroactive species and electrode surface [31,32].…”

Section: Introductionmentioning

confidence: 99%

Cyclic voltammetric determination of capsaicin by using electrochemically deposited tin and reduced graphene oxide on screen-printed carbon electrodes

Numphud¹,

Chienthavorn²,

Siriwatcharapiboon³

2020

ScienceAsia

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Tin and reduced graphene oxide (Sn/rGO) was prepared by an electrochemical deposition and modified on a screen-printed carbon electrode (SPCE) in order to improve the electrode selectivity and sensitivity for determination of capsaicin in real samples. The modified electrode was characterized for its surface morphology by scanning electron microscopy (SEM). An elemental analysis of prepared catalysts was confirmed by energy dispersive spectroscopy (EDS) and x-ray photoelectron spectroscopy (XPS). The experimental conditions influencing determination of capsaicin were optimized. The experiment was carried out in a sodium acetate buffer solution pH 3.0 at a scan rate of 50 mV/s. The Sn/rGO/SPCE showed a linear working range of 0.2-22 µM of capsaicin concentrations. The limit of detection and limit of quantification were 0.005 µM (S/N=3) and 0.02 µM (S/N=10), respectively. The prepared electrode was successfully applied to determine capsaicin in real chili samples and chili sauces.

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“…[5][6][7][8][9] Sn and its alloy coatings have been used in numerous industrial applications such as the automobile industry, [10] microelectronics, [11] aeronautics, [12] and the food industry. [13] Sn and its alloys have been widely used for imparting corrosion resistance to active metal substrates in aggressively corrosive environments. In addition, Sn is non-toxic compared to metals such cadmium (toxic) and nickel (allergenic).…”

Section: Introductionmentioning

confidence: 99%

Effect of Sodium Bromide on the Electrodeposition of Sn, Cu, Ag and Ni from a Deep Eutectic Solvent-Based Ionic Liquid

Alesary¹

2019

International Journal of Electrochemical Science

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A number of studies into the influence of additives on the electrodeposition of metals from aqueous solution have been reported in the literature. However, very few have studied the influence of additives on metal electrodeposition in Deep Eutectic Solvents (DESs). This work will show, for the first time, the effect of sodium bromide on the electrodeposition of tin, copper, silver and nickel from a deep eutectic solvent (DES)-based ionic liquid consisting of a stoichiometric 1:2 mix of choline chloride and ethylene glycol (Ethaline 200). It is shown that in the presence of sodium bromide, bright and smooth Cu and Ni deposits were formed. Cyclic voltammetry and chronocoulometry have been used to examine the electrochemical properties of the plating liquids in both the absence and presence of sodium bromide. It was found that the redox peak currents of the Sn and Ag electrolytes get smaller when sodium bromide is added to the electrolyte solution. The resultant surface morphologies, topography and roughness of Sn, Cu, Ag and Ni were investigated by scanning electron microscopy (SEM/ EDXS) and 3D optical microscopy (3D). The current efficiency of metal deposits was found to increase when the deposition was achieved from an electrolyte that contained sodium bromide.

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Studies on the electrodeposition of tin from acidic chloride–gluconate solutions

Cited by 29 publications

References 21 publications

Effect of Organic Additives on Electrodeposition of Tin From Acid Sulfate Solution

Effect of Organic Additives on Electrodeposition of Tin From Acid Sulfate Solution

Cyclic voltammetric determination of capsaicin by using electrochemically deposited tin and reduced graphene oxide on screen-printed carbon electrodes

Effect of Sodium Bromide on the Electrodeposition of Sn, Cu, Ag and Ni from a Deep Eutectic Solvent-Based Ionic Liquid

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