2010
DOI: 10.1088/0963-0252/19/2/025013
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Study of SF6and SF6/O2plasmas in a hollow cathode reactive ion etching reactor using Langmuir probe and optical emission spectroscopy techniques

Abstract: In this work, electrical and optical studies of SF 6 and SF 6 /O 2 plasmas generated in a hollow cathode reactive ion etching reactor were performed using the Langmuir probe and optical emission spectroscopy techniques, respectively. We carried out an investigation aimed at understanding the influence of radio-frequency power, gas pressure and O 2 gas mixing ratio on plasma parameters, namely electron temperature, electron density and electronegativity, and also atomic fluorine density. The results indicate an… Show more

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Cited by 18 publications
(12 citation statements)
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“…However, this drop in the electron temperature would probably be canceled out by the effects of O 2 . Based on previous measurements on this reactor [33] and elsewhere [49,50], the electron temperature would increase with the addition of O 2 to the feedstock. Also, the electron density would probably increase with the addition of O 2 , however previous findings indicate only small variations of the electron density for an…”
Section: Dissociation Fractions In Sf 6 /O 2 /Ar and Sf 6 /Ar Dischargesmentioning
confidence: 89%
“…However, this drop in the electron temperature would probably be canceled out by the effects of O 2 . Based on previous measurements on this reactor [33] and elsewhere [49,50], the electron temperature would increase with the addition of O 2 to the feedstock. Also, the electron density would probably increase with the addition of O 2 , however previous findings indicate only small variations of the electron density for an…”
Section: Dissociation Fractions In Sf 6 /O 2 /Ar and Sf 6 /Ar Dischargesmentioning
confidence: 89%
“…This level may be related to the OH groups adsorbed on the surface of the films [44,52]. Furthermore, the γ level may also be related to Si impurity, which secretes from the substrate to the film [44,53]. Nevertheless, this latter possibility is unlikely, since the Si segregation was observed only in materials submitted to temperatures exceeding 800 • C [44].…”
Section: Optical and Electrical Propertiesmentioning
confidence: 99%
“…The maximum rates are observed for SF 6 concentrations between 80% and 90%. The low etch rates for lower concentrations of SF 6 can be attributed to the lower effective temperature of electrons in the plasma, while at higher concentrations it can be due to the lowering of electron density [24,25], both of which influence the degree of ionization in the plasma chamber and the etching of polysilicon. At the same time, the presence of oxygen can also be important for the improvement of the etching efficiency by removing the polymer products formed during etching.…”
Section: Resultsmentioning
confidence: 99%