Study of surface treatment processes for improvement in the wettability of silicon-based materials used in high aspect ratio through-via copper electroplating

Dixit, Pradeep; Chen, Xiaofeng; Miao, Jianmin; Divakaran, Sheeja; Preisser, Robert

doi:10.1016/j.apsusc.2007.04.067

Cited by 39 publications

(23 citation statements)

References 31 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…From an experimental point of view, the wetting properties of the membrane walls have to be altered to allow the pore to be filled with the aqueous electrolyte. This can be achieved by suitable chemical treatment [32,33]. While a non-gelified organic phase should be employed, the viscosity of the aqueous phase should be increased, for example by addition of sucrose [34].…”

Section: Discussionmentioning

confidence: 99%

Optimisation of the conditions for stripping voltammetric analysis at liquid–liquid interfaces supported at micropore arrays: a computational simulation

Strutwolf

Arrigan

2010

Anal Bioanal Chem

View full text Add to dashboard Cite

Micropore membranes have been used to form arrays of microinterfaces between immiscible electrolyte solutions (µITIES) as a basis for the sensing of non-redox-active ions. Implementation of stripping voltammetry as a sensing method at these arrays of µITIES was applied recently to detect drugs and biomolecules at low concentrations. The present study uses computational simulation to investigate the optimum conditions for stripping voltammetric sensing at the µITIES array. In this scenario, the diffusion of ions in both the aqueous and the organic phases contributes to the sensing response. The influence of the preconcentration time, the micropore aspect ratio, the location of the microinterface within the pore, the ratio of the diffusion coefficients of the analyte ion in the organic and aqueous phases, and the pore wall angle were investigated. The simulations reveal that the accessibility of the microinterfaces during the preconcentration period should not be hampered by a recessed interface and that diffusional transport in the phase where the analyte ions are preconcentrated should be minimized. This will ensure that the ions are accumulated within the micropores close to the interface and thus be readily available for back transfer during the stripping process. On the basis of the results, an optimal combination of the examined parameters is proposed, which together improve the stripping voltammetric signal and provide an improvement in the detection limit.

show abstract

Section: Discussionmentioning

confidence: 99%

Optimisation of the conditions for stripping voltammetric analysis at liquid–liquid interfaces supported at micropore arrays: a computational simulation

Strutwolf

Arrigan

2010

Anal Bioanal Chem

View full text Add to dashboard Cite

show abstract

“…1, 2.5 × 2.5 cm 2 , Corning life Sciences, Netherlands) without any surface treatment; (2) cover slips after immersion in piranha bath (96% H 2 SO 4 +30% H 2 O 2 in 3:1 molar ratio) for over 1 day, which makes the glass hydrohiphilic. Wet treatment of glass in piranha creates both hydroxyl (−OH) and sulfhydryl (−SH) groups on glass surface responsible for the increased surface hydrophilicity 49, 56–58 . The surface hydrophilicity characteristics for both the as-received glass slide and the ones after piranha treatment were quantified by performing the static contact angle measurements.…”

Section: Methodsmentioning

confidence: 99%

A novel technique for micro-patterning proteins and cells on polyacrylamide gels

2012

View full text Add to dashboard Cite

Spatial patterning of proteins (extracellular matrix, ECM) for living cells on polyacrylamide (PA) hydrogels has been technically challenging due to the compliant nature of the hydrogels and their aqueous environment. Traditional micro-fabrication process is not applicable. Here we report a simple, novel and general method to pattern a variety of commonly used cell adhesion molecules, i.e. Fibronectin (FN), Laminin (LN) and Collagen I (CN), etc. on PA gels. The pattern is first printed on a hydrophilic glass using polydimethylsiloxane (PDMS) stamp and micro-contact printing (μCP). Pre-polymerization solution is applied on the patterned glass and is then sandwiched by a functionalized glass slide, which covalently binds to the gel. The hydrophilic glass slide is then peeled off from the gel when the protein patterns detach from the glass, but remain intact with the gel. The pattern is thus transferred to the gel. The mechanism of pattern transfer is studied in light of interfacial mechanics. It is found that hydrophilic glass offers strong enough adhesion with ECM proteins such that a pattern can be printed, but weak enough adhesion such that they can be completely peeled off by the polymerized gel. This balance is essential for successful pattern transfer. As a demonstration, lines of FN, LN and CN with widths varying from 5–400 μm are patterned on PA gels. Normal fibroblasts (MKF) are cultured on the gel surfaces. The cell attachment and proliferation are confined within these patterns. The method avoids the use of any toxic chemistry often used to pattern different proteins on gel surfaces.

show abstract

“…Figure 6c shows that copper seed layer completely disappeared from the partial sidewall of via when copper seed layer is oxidized for 1 h in chamber. Considered that the copper seed layer is not uniform when the ''scallops'' structure exists on the sidewall of via, the copper seed layer is thinner at the top of ''scallops'' structure and it is corroded by acid [2,20,24,25]. As shown in Fig.…”

Section: Resultsmentioning

confidence: 99%

“…Although utilizing stirring with ethanol in pre-wetting process to achieve void-free deposition is reported by Moffat and Dow, details of pre-wetting are not illustrated [2,[16][17][18]. Compared with ethanol as pre-wetting liquid with high speed rotation, vacuuming with pre-wetting liquid demonstrate the ability to pre-wet the high aspect ratio [19,20]. In our former research, the disruption of copper seed layer has happened when ultrasonics is used as pretreatment.…”

Section: Introductionmentioning

confidence: 88%

Pretreatment to assure the copper filling in through-silicon vias

Luo

Zhang

et al. 2016

J Mater Sci: Mater Electron

View full text Add to dashboard Cite

Copper seed layer repair and pre-wetting are standard operation procedures (SOPs) for copper filling with void-free, through-silicon vias (TSVs). In this paper, a novel pretreatment with pre-wetting and cleaning is investigated based on the results of copper filling in via when copper oxide is present on the surface of the seed layer. The pre-wetting and cleaning are integrated into one step in the pretreatment. Basic Electrolyte Solution (BES) is chosen to be pre-wetting acidic liquid. A copper seed layer formed on a wafer by sputter deposition was put into chamber to grow native copper oxide. To investigate the damage of the pretreatment, the corrosive rate of BES was measured by cathodic chronopotentiograms. The results show that BES can clean the copper oxide on the surface of the seed layer without corroding the copper seed layer. The combined pre-wetting and cleaning, pretreatment simplifies the SOP, especially for copper oxide on the seed layer. The conclusions drawn from the experimental results were employed in TSVs. Furthermore, there is one essential requirement for the pretreatment: the thickness of the copper seed layer must be more than 5 nm after the copper is oxidized on the surface of the seed layer.

show abstract

Study of surface treatment processes for improvement in the wettability of silicon-based materials used in high aspect ratio through-via copper electroplating

Cited by 39 publications

References 31 publications

Optimisation of the conditions for stripping voltammetric analysis at liquid–liquid interfaces supported at micropore arrays: a computational simulation

Optimisation of the conditions for stripping voltammetric analysis at liquid–liquid interfaces supported at micropore arrays: a computational simulation

A novel technique for micro-patterning proteins and cells on polyacrylamide gels

Pretreatment to assure the copper filling in through-silicon vias

Contact Info

Product

Resources

About