Study on Aging Effect of Adhesion Strength Between Polyimide Film and Copper Layer

Koo, Seokbon; Lee, Chang-Myeon; Kwon, SangJoo; Jeon, Ji-Hong; Hur, Jaehyun; Lee, Hong‐Kee

doi:10.1007/s12540-018-0167-7

Cited by 20 publications

(13 citation statements)

References 30 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Kapton film produced by Dupont is the most famous polyimide, used to create flexible printed circuit boards (PCBs) with a copper layer on one side. Due to its weak adhesion with untreated polyimide [ 38 ], copper may be coupled with an intermediary metal layer such as titanium, chromium or aluminium.…”

Section: Materials Choicementioning

confidence: 99%

Cleanroom strategies for micro- and nano-fabricating flexible implantable neural electronics

Walton

Cerezo-Sánchez

McGlynn

et al. 2022

Phil. Trans. R. Soc. A.

View full text Add to dashboard Cite

Implantable electronic neural interfaces typically take the form of probes and are made with rigid materials such as silicon and metals. These have advantages such as compatibility with integrated microchips, simple implantation and high-density nanofabrication but tend to be lacking in terms of biointegration, biocompatibility and durability due to their mechanical rigidity. This leads to damage to the device or, more importantly, the brain tissue surrounding the implant. Flexible polymer-based probes offer superior biocompatibility in terms of surface biochemistry and better matched mechanical properties. Research which aims to bring the fabrication of electronics on flexible polymer substrates to the nano-regime is remarkably sparse, despite the push for flexible consumer electronics in the last decade or so. Cleanroom-based nanofabrication techniques such as photolithography have been used as pattern transfer methods by the semiconductor industry to produce single nanometre scale devices and are now also used for making flexible circuit boards. There is still much scope for miniaturizing flexible electronics further using photolithography, bringing the possibility of nanoscale, non-invasive, high-density flexible neural interfacing. This work explores the fabrication challenges of using photolithography and complementary techniques in a cleanroom for producing flexible electronic neural probes with nanometre-scale features. This article is part of the theme issue 'Advanced neurotechnologies: translating innovation for health and well-being'.

show abstract

Section: Materials Choicementioning

confidence: 99%

Cleanroom strategies for micro- and nano-fabricating flexible implantable neural electronics

Walton

Cerezo-Sánchez

McGlynn

et al. 2022

Phil. Trans. R. Soc. A.

View full text Add to dashboard Cite

show abstract

“…Recently, Cu thin lms, chie y on exible polymer substrates such as PET, have become of high importance for exible printed circuit boards [20]. The fabrication of metal thin-lms on polymer substrates is studied in many different con gurations such as copper on PTFE [21], copper on polyimide [22], silver/ uorocarbon nanocomposites on PET [23], aluminum on PET [24] and silver on PET [25], etc.…”

Section: Introductionmentioning

confidence: 99%

Structural, Mechanical and Electrical Properties of Sputter Coated Copper Thin Films on Poly Ethylene Terephthalate 

Atta

Abdeltwab

Bek

2021

Preprint

View full text Add to dashboard Cite

Copper (Cu) thin films are deposited on polyethyleneterephthalate (PET) substrate using ion-beam-sputtering technique. The formation of Cu thin films is successful confirmed as investigated by X-ray diffraction (XRD). Surface morphology of Cu/PET is studied by atomic force microscopy (AFM). The AFM results show that Cu film dewets PET surface and the surface roughness increased from 22.6 nm for PET to 45.3 nm after 40min of deposited Cu/PET. The sheet resistance decreases from 5.16x104Ω to 1.3x104Ω and resistivity decreases from 2.3x10-2Ω.cm to 1.77x10-2Ω.cm, as the Cu deposition time increases from 20min to 60min. The Young’s modulus increases from 2.82GPa to 2.96GPa and the adhesion force enhanced from 14.7nN to 29.90nN after 40min of Cu deposition. The DC electrical conductivity at 300V is improved from 1.75x10-8 S.cm-1 to 3.57x10-8 S.cm-1 after 60min of Cu deposition. The results show that ion beam deposition of Cu on flexible PET platform clearly exhibits improvement over pristine PET in the mechanical and electrical properties which renders it useful for electronics applications.

show abstract

“…The increasing use of transparent conducting oxide (TCO) thin films for various display devices is stimulating the development of inexpensive TCO films that simultaneously have high optical transmittance and low resistivity [1].…”

Section: Introductionmentioning

confidence: 99%

Electron Irradiation Effects on the Optical and Electrical Properties of ZnO/Ag/SnO2 Thin Films

Kim¹,

Choi²,

park³

et al. 2020

Korean J. Met. Mater.

View full text Add to dashboard Cite

Transparent conductive ZnO 50 nm/Ag 10 nm/SnO2 50 nm (ZAS) tri-layer films were deposited on glass substrates by magnetron sputtering, and then the surface was subjected to intense electron beam irradiation to investigate the effects of electron irradiation on the structural, optical, and electrical properties of the films. After deposition, the ZAS thin films were electron-irradiated for 10 minutes, with varying electron incident energies of 300, 600, and 900 eV. The films that were electron irradiated at 900 eV showed higher optical transmittance of 83.6% in the visible wavelength region, and lower resistivity, of 4.75 × 10-5 Ωcm, than the other films. From the observed electrical properties and optical band gap, it was concluded that the optical band gap increased with the incident electron energy up to 600 eV. The optical band gap increased from 4.12 to 4.23 eV, with carrier density increasing from 7.09 to 8.55 × 1021 cm−3. However, the film electron irradiated at 900 eV showed a decrease in optical band gap energy of 4.16 eV due to the decreased carrier density of 8.25 × 1021 cm−3. The figure of merit revealed that the ZAS thin films electron-irradiated at 900 eV had higher optical and electrical performance than the other films prepared in this study.

show abstract

Study on Aging Effect of Adhesion Strength Between Polyimide Film and Copper Layer

Cited by 20 publications

References 30 publications

Cleanroom strategies for micro- and nano-fabricating flexible implantable neural electronics

Cleanroom strategies for micro- and nano-fabricating flexible implantable neural electronics

Structural, Mechanical and Electrical Properties of Sputter Coated Copper Thin Films on Poly Ethylene Terephthalate

Electron Irradiation Effects on the Optical and Electrical Properties of ZnO/Ag/SnO<sub>2</sub> Thin Films

Contact Info

Product

Resources

About

Study on Aging Effect of Adhesion Strength Between Polyimide Film and Copper Layer

Cited by 20 publications

References 30 publications

Cleanroom strategies for micro- and nano-fabricating flexible implantable neural electronics

Cleanroom strategies for micro- and nano-fabricating flexible implantable neural electronics

Structural, Mechanical and Electrical Properties of Sputter Coated Copper Thin Films on Poly Ethylene Terephthalate&nbsp;

Electron Irradiation Effects on the Optical and Electrical Properties of ZnO/Ag/SnO<sub>2</sub> Thin Films

Contact Info

Product

Resources

About

Structural, Mechanical and Electrical Properties of Sputter Coated Copper Thin Films on Poly Ethylene Terephthalate