Study on composite electroforming of Cu/SiCp composites

Zhu, Jianhua; Лю, Лэй; Hu, Guohua; Shen, Bin; Hu, Wenbin; Ding, Wenjiang

doi:10.1016/j.matlet.2003.08.040

Cited by 45 publications

(28 citation statements)

References 6 publications

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“…The increase in microhardness with Si 3 N 4 particle incorporation can be explained by two reasons: (i) dispersion-strengthening and (ii) grain refining. Dispersionstrengthening is associated to the incorporation of fine particles and volume fraction lower than 15% [24] which corresponds to our conditions (Si 3 N 4 particle size lower than 2 lm and 7.8% highest incorporated particle volume fraction). In this case, the matrix carries the load and the small particles hinder dislocation motion.…”

Section: Microhardnesssupporting

confidence: 71%

“…For a given current density a clear tendency of increasing in microhardness with the increase of incorporated Si 3 N 4 particle content is observed. The higher microhardness of copperparticle composite coatings when compared to that of pure copper was also observed for the incorporation of other types of particles to copper, such as SiC [6,24], Al 2 O 3 [6,7], and ZrB 2 [14]. The increase in microhardness with Si 3 N 4 particle incorporation can be explained by two reasons: (i) dispersion-strengthening and (ii) grain refining.…”

Section: Microhardnessmentioning

confidence: 86%

“…In relation to particle concentration effect, Zhu [24] showed an increase of incorporated SiC particle fraction when the particle concentration increased from 15 to 35 g L -1 but a decrease between 35 and 45 g L -1 . Differently, Stankovic and Gojo [6] evidenced an increase of both Al 2 O 3 and SiC particle contents when their concentration in the bath increased from 20 to 125 g L -1 .…”

Section: Coatings Morphology Texture and Particle Contentmentioning

confidence: 96%

“…For example, Zhu [24] observed an increase in SiC particle content when the current density increased from 20 to 50 mA cm -2 but a decrease for densities higher than 50 mA cm -2 . In the other hand, Hayashi [5] showed that the incorporated Si 3 N 4 particles using 20 mA cm -2 current density Al 2 O 3 particle fraction diminished when the current density increased from 10 to 70 mA cm -2 .…”

Section: Coatings Morphology Texture and Particle Contentmentioning

confidence: 99%

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Characterization of copper–silicon nitride composite electrocoatings

2009

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Silicon nitride particles were incorporated to electrolytic copper by co-electrodeposition in acidic sulfate bath, aiming the improvement of its mechanical resistance.Smooth deposits containing well-distributed silicon nitride particles were obtained. The current density did not show significant influence on incorporated particle volume fraction, whereas the variation of particle concentration in the bath had a more pronounced effect. The microhardness of the composite layers was higher than that of pure copper deposits obtained under the same conditions and increased with the increase of incorporated particle volume fraction. The microhardness of composites also increased with the increase of current density due to copper matrix grain refining. The composite coatings were slightly more corrosion resistant than pure copper deposits in 3.5% NaCl solutions.

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Section: Microhardnesssupporting

confidence: 71%

Section: Microhardnessmentioning

confidence: 86%

Section: Coatings Morphology Texture and Particle Contentmentioning

confidence: 96%

Section: Coatings Morphology Texture and Particle Contentmentioning

confidence: 99%

See 2 more Smart Citations

Characterization of copper–silicon nitride composite electrocoatings

2009

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“…There were a large number of studies focused on the process of electroforming [4][5][6][7]. However, the investigations on the microstructure are few.…”

Section: Introductionmentioning

confidence: 99%

Mechanical properties of electroformed copper layers with gradient microstructure

Liu

Zhou

Liu

et al. 2010

Int J Miner Metall Mater

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The electroformed copper layer with gradient microstructure was prepared using the ultrasonic technique. The microstructure of the electroformed copper layer was observed by using an optical microscope (OM) and a scanning electron microscope (SEM). The preferred orientations of the layer were characterized by X-ray diffraction (XRD). The mechanical properties were evaluated with a Vicker's hardness tester and a tensile tester. It is found the gradient microstructure consists of two main parts: the outer part (faraway substrate) with columnar crystals and the inner part (nearby substrate) with equiaxed grains. The Cu-(220) preferred orientation increases with the increasing thickness of the copper layer. The test results show that the microhardness of the electroformed copper layer decreases with increasing grain size along the growth direction and presents a gradient distribution. The tensile strength of the outer part of the electroformed copper layer is higher than that of the inner part but at the cost of ductility. Meanwhile, the integral mechanical properties of the electroformed copper with gradient microstructure are significantly improved in comparison with the pure copper deposit.

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Metal Matrix Composites: Corrosion

Salvago

Bestetti

2011

Wiley Encyclopedia of Composites

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Metal matrix composites (MMCs) are important materials usually designed for applications where the mechanical performances are the most important technical requirements. Nowadays, the applications of MMCs are not only limited to automotive and aerospace industries but also they are widespread into other industries. In this respect, it becomes important to take into account also the corrosion resistance behavior of MMCs, in relation to different factors, such as metal matrix composition and microstructure, particles composition, size, and dispersion, environments where MMCs are used. This article is a comprehensive literature review on the corrosion mechanisms and the methods used to prevent corrosion for the most important types of MMCs. In this article, different metal matrices are considered, by taking into account generally active ones (Mg), those with amphoteric characteristics (Al, Zn), noble metal matrices with film‐forming corrosion products (Cu), and those that form passivation layers affected by chlorides (steel, Ni), and finally metal matrices with stable passivity (Ti).

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Study on composite electroforming of Cu/SiCp composites

Cited by 45 publications

References 6 publications

Characterization of copper–silicon nitride composite electrocoatings

Characterization of copper–silicon nitride composite electrocoatings

Mechanical properties of electroformed copper layers with gradient microstructure

Metal Matrix Composites: Corrosion

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