Study on sapphire removal for thin-film LEDs fabrication using CMP and dry etching

Zhou, Shengjun; Liu, Sheng

doi:10.1016/j.apsusc.2009.07.063

Cited by 55 publications

(26 citation statements)

References 25 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…For flip chip, the sapphire will be further polished before the dicing. Our group has shown that sapphire of flip chip can also realize mirror surface with δ lower than 1 nm [60]. But for some commercial LEDs, the surface of sapphire is a little rough, δ of which may be as high as 5 nm, as shown in Fig.…”

Section: Light Scattering On Nano-rough Surfaces Of Blue Ledsmentioning

confidence: 99%

Precise optical modeling of blue light-emitting diodes by Monte Carlo ray-tracing

Liu¹,

Wang²,

Luo³

et al. 2010

Opt. Express

Self Cite

122

View full text Add to dashboard Cite

Precise optical modeling of blue light-emitting diodes (LEDs) is constructed by reasonable optical parameters and Monte Carlo ray-tracing with the capability of precisely predicting light extraction and radiation pattern for both bare LED and packaged LED. Refractive indices and absorption coefficients of LED materials are determined by abundant references and comparisons between simulations and experiments. Surface roughness is considered in the optical model to improve the simulation precision. The simulation precisions are excellent for both bare blue LEDs (>96.5% for light extraction and >99% for radiation pattern) and packaged blue LEDs (>98.5% for both light extraction and radiation pattern).

show abstract

Section: Light Scattering On Nano-rough Surfaces Of Blue Ledsmentioning

confidence: 99%

Precise optical modeling of blue light-emitting diodes by Monte Carlo ray-tracing

Liu¹,

Wang²,

Luo³

et al. 2010

Opt. Express

Self Cite

122

View full text Add to dashboard Cite

show abstract

“…However, sapphire's extreme hardness and chemical resistance make the abrasion process difficult to perform [16,17]. It particularly makes lapping a challenge because a high removal rate is required to control the thickness and flatness of the substrate.…”

Section: Introductionmentioning

confidence: 99%

Comparison between sapphire lapping processes using 2-body and 3-body modes as a function of diamond abrasive size

Kim

Park

Seo

et al. 2015

Wear

View full text Add to dashboard Cite

“…Softer silica abrasive and alkalescence polishing liquid are typically used in CMP to polish the sapphire wafers. But it is well known that sapphire is chemically inert and insoluble in most substances [6][7][8]. Therefore, it is extremely difficult to polish the sapphire substrates with traditional CMP technology at room temperature to obtain high material remove rate (MRR) and perfect polished surface simultaneously.…”

Section: Introductionmentioning

confidence: 99%

The Research of Reactivity between Nano-abrasives and Sapphire during Polishing Process

2015

Integrated Ferroelectrics

View full text Add to dashboard Cite

Reactivity between nano-sized abrasives and sapphire wafer has been studied by interfacial solid state reaction during polishing process, and the abrasive with the highest reactivity has been selected from magnesium oxide, silicon dioxide and ferric oxide. Using the Sol-Gel polishing films, sapphire wafers were polished in the form of wet and dry mechanical chemical polishing respectively. The Raman spectra and Grazing incidence X-ray diffraction records show that aluminum silicate with the composition mullite was formed on the polished wafer surface, and silicon dioxide has the highest reactivity than other oxide abrasives under the same conditions during polishing the sapphire substrates.

show abstract

Study on sapphire removal for thin-film LEDs fabrication using CMP and dry etching

Cited by 55 publications

References 25 publications

Precise optical modeling of blue light-emitting diodes by Monte Carlo ray-tracing

Precise optical modeling of blue light-emitting diodes by Monte Carlo ray-tracing

Comparison between sapphire lapping processes using 2-body and 3-body modes as a function of diamond abrasive size

The Research of Reactivity between Nano-abrasives and Sapphire during Polishing Process

Contact Info

Product

Resources

About