Study on structural, morphological and electrical properties of sputtered titanium nitride films under different argon gas flow

Research on titanium nitride thin films deposited by reactive magnetron sputtering for MEMS applications

“…This type of ceramic can be employed as diffusion barrier in microelectronics, protective coatings for biomedical devices, hard and decorative coatings of mechanical tools or for manufacturing micro-gap discharge devices. The properties that make titanium nitride suitable for applications such as mentioned above are its high hardness, good adhesive wear and resistance to corrosion, high melting temperature, thermal and chemical stability, biocompatibility and so forth [6][7][8][9][10].…”

Influence of controlled deposition rate on mechanical properties of sputtered Ti thin films for MEMS application

“…It is known that Ti films deposited by various physical vapor deposition methods generally grow in three crystallographic orientations (i.e. (2 0 0), (1 1 1) and (2 2 0)) [19]. The preferred orientation of a film results from its lowest overall energy, which is a result of competition between the surface energy, the strain energy, and the stopping energy of different lattice planes [20,21].…”

“…In the case of Ti films, the (2 0 4) plane has the lowest surface energy, the (1 1 1) plane has the lowest strain energy, and the (2 1 5) plane has the lowest stopping energy. Only when the deposited ion energy is sufficiently high, the stopping energy becomes dominant, and the preferred (2 1 5) orientation can be observed [19]. Hence, one may propose that only surface energy and strain energy have affected the film growth process.…”

“…The crystallite size of 3579Å at the deposition time of 900 s and substrate temperature of 673 K can be attributed to the enhanced energetic ion bombardment and promoted mobility of adatoms. When the deposition and substrate temperature increases, the ion density becomes large enough for crystal growth [19,23]. …”

The Study of Surface Properties of Tokamak First Wall Using TiN Coated on Stainless Steel

“…The formation of this layer may not be enough to avoid wear under severe testing conditions. Physical vapor deposition (PVD) techniques such as direct-current (DC) magnetron sputtering, ion plating, and plasma-based ion implantation are employed to deposit TiN thin films [10][11][12].…”