1981
DOI: 10.1016/0022-0248(81)90201-3
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Study on the growth rate in VPE of GaN

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Cited by 58 publications
(49 citation statements)
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“…4 for a fixed HCl flow of 3 sccm. First the GaN growth rate is observed to increase with the introduction of hydrogen in the system, in agreement with previous work of Seifert et al [4], up to a maximum at a H 2 partial pressure of 0.15 atm, and then to decrease monotonically. A decrease of the growth rate with the introduction of hydrogen at partial pressures in the range of 0.3 atm to 0.5 atm was also observed during epitaxial lateral overgrowth on patterned substrates [5].…”
Section: Resultssupporting
confidence: 80%
“…4 for a fixed HCl flow of 3 sccm. First the GaN growth rate is observed to increase with the introduction of hydrogen in the system, in agreement with previous work of Seifert et al [4], up to a maximum at a H 2 partial pressure of 0.15 atm, and then to decrease monotonically. A decrease of the growth rate with the introduction of hydrogen at partial pressures in the range of 0.3 atm to 0.5 atm was also observed during epitaxial lateral overgrowth on patterned substrates [5].…”
Section: Resultssupporting
confidence: 80%
“…(001) GaAs was used as model [2] based on the numerous experiments carried out under various conditions of the chloride method. As explained in [1] the only experimental curves available for computing the model parameters in the GaN HVPE system were the curves reported by Seifert et al [3]. With respect to the GaAs model we have only added a HCl adsorption step in agreement with the quantum chemical study of Seifert et al [4] and we have not overlooked the GaN adsorption.…”
Section: Introductionsupporting
confidence: 51%
“…The objective of this paper is only to present a few theoretical results making it possible to approach the mass transfer and parasitical nucleation effects on the growth rate. In the first part of the paper we recall briefly the physics of the model, then we discuss the theoretical curves obtained by Seifert et al [3] and Paskova et al [5]. These parts are followed by a short conclusion.…”
Section: Introductionmentioning
confidence: 99%
“…The foreign substrate is removed from the sample by etching or other lift off technique and then a large diameter free-standing GaN wafer may be obtained. The big advantage of this method is relatively fast growth rate in the c-direction, exceeding sometimes 100 µm/h [2][3][4]. In turn, the big disadvantage is parasitic deposition of GaN out of the substrate that leads to significant changes in growth conditions during the process.…”
Section: Introductionmentioning
confidence: 99%