Study on thermal conductive BN/novolac resin composites

Li, Shasha; Qi, Shuhua; Liu, Nailiang; Cao, Peng

doi:10.1016/j.tca.2011.05.010

Cited by 69 publications

(47 citation statements)

References 27 publications

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“…The κ c , κ m , and κ p represents the thermal conductivity of the SiC–BN composites, the SiC matrix and the BN filler, respectively, and Φ is the volume fraction of BN. Theoretical values were calculated using thermal conductivities of 140 W·(m·K) −1 for SiC matrix and 33 W·(m·K) −1 for BN filler, respectively. The significant difference between the experimental data and the theoretical ones of the SiC–BN composites was probably attributed to the decreased intrinsic thermal conductivity of SiC grains with BN addition.…”

Section: Resultsmentioning

confidence: 99%

Microstructure, Thermal Conductivity, and Electrical Properties of In Situ Pressureless Densified SiC–BN Composites

Yin

et al. 2014

J. Am. Ceram. Soc.

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The microstructure, thermal conductivity, and electrical properties of pressureless densified SiC–BN composites prepared from in situ reaction of Si3N4, B4C, and C were systematically investigated, to achieve outstanding performance as substrate materials in electronic devices. The increasing BN content (0.25–8 wt%) in the composites resulted in finer microstructure, higher electrical resistivity, and lower dielectric constant and loss, at the expense of only slight degradation of thermal conductivity. The subsequently annealed composites showed more homogeneous microstructures with less crystal defects, further enhanced thermal conductivities and electrical resistivities, and reduced dielectric constants and losses, compared with the unannealed ones. The enhanced insulating performance, the weakened interface polarization, and the reduced current conduction loss were explained by the gradual equalization of dissolved B and N contents in SiC crystals and the consequent impurity compensation effect. The schottky contact between graphite and p‐type SiC grains presumably played a critical role in the formation of grain‐boundary barriers. The annealed composites doped with 8 wt% BN exhibited considerably high electrical resistivity (4.11 × 1011 Ω·cm) at 100 V/cm, low dielectric constant (16.50), and dielectric loss (0.127) at 1 MHz, good thermal conductivity [66.06 W·(m·K)−1] and relatively high strength (343 MPa) at room temperature.

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Section: Resultsmentioning

confidence: 99%

Microstructure, Thermal Conductivity, and Electrical Properties of In Situ Pressureless Densified SiC–BN Composites

Yin

et al. 2014

J. Am. Ceram. Soc.

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“…2 As we know, there are three kinds of packaging materials, such as metal-based, ceramic-based and plastic-based packaging materials. 6,7 The main mechanism is to build a thermally conductive path in the matrix by adding the fillers with the high thermal conductivity. Plastic packaging materials are widely used in civilian areas due to their advantages in terms of cost and density.…”

Section: Introductionmentioning

confidence: 99%

Tuning of thermal and dielectric properties for epoxy composites filled with electrospun alumina fibers and graphene nanoplatelets through hybridization

Zha

Zhu

et al. 2015

J. Mater. Chem. C

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Epoxy resin is widely used for electrical and electronics packaging in various forms due to its excellent adhesion, low cure shrinkage and good electrical insulation. However, the low thermal conductivity and mismatched dielectric properties limit its application in highly integrated circuits. In this work, alumina fibers (AFs) were firstly prepared via electrospinning with sol-gel precursor. Epoxy (EP) composites with graphene nanoplatelets (GNPs) and AFs were fabricated using a hot-pressing process. Microstructures, thermal conductivity and dielectric properties of EP hybrid composites were studied. Scanning electron microscopy images reveal that the modified AFs and GNPs were uniformly dispersed in the epoxy matrix and the thermal conductive reticular structures were formed. The AFs can not only link the GNPs and epoxy but also reduce the interfacial thermal resistance so that a high thermal conductivity of 1.62 W m À1 K À1 is realized in the EP-GNP-AF composite, which is about 8 times higher than pure EP.The decomposition temperature of the epoxy composites with 2 vol% GNP and 50 vol% AF loading was enhanced by about 100 degrees. Dielectric properties of EP composites have a strong dependence on frequency and a weak dependence on temperature, which gives rise to the potential in different electronic/ electrical field applications.

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“…To ensure proper device operation, the unwanted heat must be removed (Choi et al 2012). Today, in order to satisfy increasing heat dissipation requirements, filled polymers are widely used in electronic packaging for device encapsulation because of their high thermal conductivity, light weight, chemical inertness, and reliability against fracture of many plastics to transfer high degrees of heat (Li et al 2011). In addition to high thermal conductivity, a low dielectric constant is needed for fast signal propagation, and a low CTE is needed for resistance to thermal fatigue (Xu et al 2011).…”

Section: Introductionmentioning

confidence: 99%

Epoxy Composites Filled with Micro-Sized AlN Particles for Microelectronic Applications

Agrawal

Satapathy

2014

Particulate Science and Technology

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With the rapid development of the electronic information industry, better properties are required for substrate and packaging materials such as high thermal conductivity, low coefficient of thermal expansion, and low dielectric constant. Polymers are ordinarily being used for this purpose due to their high electrical resistivity and low density, but unfortunately they suffer from a disadvantage like low thermal conductivity. To offset this deficiency, adding inorganic conductive particles to polymer is a versatile method. In view of this, the present work aims at developing a class of particulate filled polymer composites with micro-sized aluminum nitride (AlN) particles having an average particle size of 60-80 mm reinforced in epoxy matrix. A set of composites, with filler content ranging from 0 to 25 vol%, have been prepared by the hand-layup technique. Effects of filler percentage on various properties like effective thermal conductivity (k eff ), coefficient of thermal expansion (CTE), glass transition temperature (T g ), and dielectric constant (E c ) are studied. It is found that the incorporation of AlN in resin increases the k eff and T g , whereas CTE of the composite decreases favorably. Though dielectric constant of the matrix increases with filler content yet it remains well within the desirable limit. With modified thermal and dielectric characteristics, these composites can possibly be used for microelectronics applications.

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Study on thermal conductive BN/novolac resin composites

Cited by 69 publications

References 27 publications

Microstructure, Thermal Conductivity, and Electrical Properties of In Situ Pressureless Densified SiC–BN Composites

Microstructure, Thermal Conductivity, and Electrical Properties of In Situ Pressureless Densified SiC–BN Composites

Tuning of thermal and dielectric properties for epoxy composites filled with electrospun alumina fibers and graphene nanoplatelets through hybridization

Epoxy Composites Filled with Micro-Sized AlN Particles for Microelectronic Applications

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