We report a direct correlation between carrier mobility and Raman topography of epitaxial graphene (EG) grown on silicon carbide (SiC). We show the Hall mobility of material on the Si-face of SiC [SiC(0001)] is not only highly dependent on thickness uniformity but also on monolayer s st tr ra ai in n uniformity. Only when both thickness and strain are uniform over a significant fraction (> 40%) of the device active area does the mobility exceed 1000 cm 2 /V-s. Additionally, we achieve high mobility epitaxial graphene (18,100 cm 2 /V-s at room temperature) on the C-face of SiC [SiC(000-1)] and show that carrier mobility depends strongly on the graphene layer stacking. These findings provide a means to rapidly estimate carrier mobility and provide a guide to achieve very high mobility in epitaxial graphene. Our results suggest that ultra-high mobilities (>50,000 cm 2 /V-s) are achievable via the controlled formation of uniform, rotationally faulted epitaxial graphene.The recent success of graphene transistor operation in the giga-hertz range has solidified the potential of this material for high speed electronic applications. 1,2 Realization of graphene technologies at commercial scales, however, necessitates large-area graphene production, as well as the ability to rapidly characterize its structural and electronic quality. Graphene films can be produced by mechanical exfoliation from bulk graphite, 3,4 reduction of graphite-oxide, 5,6 chemical vapor deposition on catalytic films, 7 or via Si-sublimation from bulk SiC substrates. 8 9, -10,11, 12 The last technique currently appears to hold the most promise for large-area electronic grade graphene, and already shows tremendous potential for high-frequency device technologies. 2 Nevertheless, precise control of the graphene electronic properties (i.e. mobility) over large areas is necessary to enable graphene-based technological applications. Realization of such control will come through an intimate understanding of the process-propertyperformance relationship and the role that graphene thickness, strain, and layer stacking plays in this relationship over very large areas up to full wafers. Of the characterization techniques used for layer thickness determination, 13 ,14,15, -16,17,18, 19 Raman spectroscopy is arguably the simplest and fastest, especially for exploring monolayer EG on SiC(0001) (referred to as EG Si )and EG layer stacking on SiC(000-1) (referred to as EG c ). [15][16][17][18][19] Characterization of EG via Raman spectroscopy requires fitting the 2D Raman peak. 15,16,20 Raman spectra of EG Si fit by one or four Lorentzian functions are characteristic of monolayer or bilayer graphene, respectively. 15 Figure 1a demonstrates layer thickness evaluation for monolayer and bilayer EG Si via Lorentzian fitting of the 2D Raman spectra. To further validate these thickness measurements, cross-sectional transmission electron microscopy (TEM) was performed (Fig. 1b,c). The TEM micrographs in Fig.1b,c include a transition layer (Layer 0), which is in dire...