Substrate-embedded and flip-chip-bonded photodetector polymer-based optical interconnects: analysis, design, and performance

Glytsis, Elias N.; Jokerst, N.M.; Villalaz, Ricardo A.; Cho, Sang-Yeon; Wu, Shun-Der; Huang, Z. Rena; Brooke, M.A.; Gaylord, Thomas K.

doi:10.1109/jlt.2003.818178

Cited by 14 publications

(4 citation statements)

References 38 publications

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“…On the other hand, the primary characteristic of the volume holographic grating architectures was found to be the possibility of wavelength and polarization selectivity as well as their independence on the separation between the PD layer and the waveguide. For the case of evanescent coupling into a substrate embedded PD, comparison of the analysis with experimental results showed good agreement [33].…”

Section: B Embedded Optical Interconnections Using Integrated Volume ...mentioning

confidence: 72%

“…Some of the embedded optical interconnection structures described herein have also been rigorously modeled. Three optoelectronic structures incorporating substrate-embedded InP-based inverted-MSM PDs and/or volume holographic gratings have been analyzed and compared at the primary optical communication wavelengths [33]. These structures, in conjunction with optical quality polymer layers, can be easily integrated into boards for the purpose of implementing board optical interconnections.…”

Section: B Embedded Optical Interconnections Using Integrated Volume ...mentioning

confidence: 99%

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Planar Lightwave Integrated Circuits With Embedded Actives for Board and Substrate Level Optical Signal Distribution

Jokerst

Gaylord

Glytsis

et al. 2004

IEEE Trans. Adv. Packag.

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As the data rate of integrated circuits dramatically increases, interconnection speed at the backplane and board levels are beginning to limit system performance, which drives investigations into alternative interconnection technologies. Critical factors to consider when evaluating alternative interconnection approaches include interconnect speed, power consumption, area, and compatibility with current backplane and board integration technologies. Optical interconnections can achieve very high speed with a significant reduction in interconnect footprint compared to transmission lines, robust signal quality in high-density interconnection systems because of immunity to electromagnetic interference, and potentially simple to design (compared to transmission lines) lines with materials which can be postprocessed onto printed wiring boards or integrated into the board structure. This paper explores design options for planar optical interconnections integrated onto boards, discusses fabrication options for both beam turning and embedded interconnections to optoelectronic devices, describes integration processes for creating embedded planar optical interconnections, and discusses measurement results for a number of integration schemes that have been demonstrated by the authors. In the area of optical interconnections with beams coupled to and from the board, the topics covered include integrated metal-coated polymer mirrors and volume holographic gratings for optical beam turning perpendicular to the board. Optical interconnections that utilize active thin film (approximately 1-5 m thick) optoelectronic components embedded in the board are also discussed, using both Si and high temperature FR-4 substrates. Both direct and evanescent coupling of optical signals into and out of the waveguide are discussed using embedded optical lasers and photodetectors. I. INTRODUCTIONA S the data rate of integrated circuits dramatically increases, interconnection speed at the backplane and board levels are beginning to limit system performance, which drives investigations into alternative interconnection technologies. Critical factors to consider when evaluating alternative in-Manuscript

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Section: B Embedded Optical Interconnections Using Integrated Volume ...mentioning

confidence: 72%

Section: B Embedded Optical Interconnections Using Integrated Volume ...mentioning

confidence: 99%

Planar Lightwave Integrated Circuits With Embedded Actives for Board and Substrate Level Optical Signal Distribution

Jokerst

Gaylord

Glytsis

et al. 2004

IEEE Trans. Adv. Packag.

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“…Diffraction gratings are designed for specific wavelengths, thus fabrication tolerance is tight in general, though they have high coupling efficiency. For evanescent couplers, a precise control of the fabrication process is needed due to exponentially decreasing coupling efficiency as the separation from the waveguide increases [12]. In contrast, embedded mirrors have less limitation in wavelength, provided the mirror surface is precisely fabricated along with controlling mirror angle.…”

Section: Introductionmentioning

confidence: 99%

Fast fabrication of polymer out-of-plane optical coupler by gray-scale lithography

Summitt¹,

Wang²,

Namnabat³

et al. 2017

Opt. Express

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Abstract:We report a fabrication process of a polymer, and mirror-based out-of-plane optical coupler. In the process, a pre-formed mirror blank made of a buffer coat material is reexposed by a laser direct writing tool with low numerical aperture of 0.1. The fabrication process is inherently fast because of the low numerical aperture (NA) process. The surface figure of the mirror is controlled under 0.04 waves in root-mean-square (RMS) at 1.55 μm wavelength, with mirror angle of 45 ± 1 degrees. Nominal insertion loss of 8.5dB of the mirror-based coupler was confirmed with polymer waveguides fabricated simultaneously.

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“…Board-level optical interconnects are currently under extensive research [3][4][5][6]. As an emerging technology, only a limited amount of reliability data on optical/electrical hybrid devices using polymeric materials is available.…”

Section: Introductionmentioning

confidence: 99%

Investigation of environmental reliability of optical polymer waveguides embedded on printed circuit boards

Immonen¹,

Karppinen²,

Kivilahti³

2007

Microelectronics Reliability

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Substrate-embedded and flip-chip-bonded photodetector polymer-based optical interconnects: analysis, design, and performance

Cited by 14 publications

References 38 publications

Planar Lightwave Integrated Circuits With Embedded Actives for Board and Substrate Level Optical Signal Distribution

Planar Lightwave Integrated Circuits With Embedded Actives for Board and Substrate Level Optical Signal Distribution

Fast fabrication of polymer out-of-plane optical coupler by gray-scale lithography

Investigation of environmental reliability of optical polymer waveguides embedded on printed circuit boards

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