2006
DOI: 10.1109/jproc.2006.886029
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Substrate Noise Coupling in SoC Design: Modeling, Avoidance, and Validation

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Cited by 106 publications
(29 citation statements)
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“…The impedance between the ring and ground pad is modeled by Z gnd . Finally, the substrate resistance between the ring and victim is represented by R sub which is determined by (1) and (2).…”
Section: B Guard Ring Isolationmentioning
confidence: 99%
See 1 more Smart Citation
“…The impedance between the ring and ground pad is modeled by Z gnd . Finally, the substrate resistance between the ring and victim is represented by R sub which is determined by (1) and (2).…”
Section: B Guard Ring Isolationmentioning
confidence: 99%
“…Substrate noise coupling continues to be a primary concern in highly heterogeneous mixed-signal circuits such as transceivers where digital and analog/RF functions are placed on the same monolithic substrate [1]. The demand for higher integration exacerbates this issue due to the reduced physical distance between the aggressor digital and sensitive analog/RF blocks.…”
Section: Introductionmentioning
confidence: 99%
“…[9] The previous simulation result in fig. 6, has been calculated by (1), After all, it is unable to show the effect of the power/ground noise on the noise figure.…”
Section: Where K=boltzman's Constant T0 = 290kmentioning
confidence: 99%
“…Such an environment imposes extremely difficult working conditions for the analogue filters due to the presence of a high level, broadband noise generated by the digital sub-circuits. The digital noise, which propagates along a silicon substrate, can significantly degrade the dynamic range of the analogue filters [3,4]. One of the most commonly used method to reduce the substrate noise interference is based on application of the fully-differential filters, capable of reducing the influence of the common-mode (CM) component of the noise.…”
Section: Introductionmentioning
confidence: 99%