VP has very good resolution but a much smaller palette of materials with higher on-average dielectric loss. A similar option to FDM is direct ink writing (DIW), where instead of a filament, functional inks are used. [2] DIW is heavily dependent on the material's viscosity, as the ink flow greatly affects the precision and resolution of the structure, and also determines if a supplementary curing system needs to be used. Inkiet (IJ) printing is a method that uses drops of liquid inks to form conductive patterns on surfaces. [3] Related to IJ is aerosol jet (AJ) printing, using ink droplets for structure fabrication and achieving a higher resolution. [4] Both of these techniques have produced great results for layer or multilayer structures, but truly 3D structures are beyond their scope.In general, FDM works well with many common thermoplastics including acetonitrile butandiene styrene (ABS), poly-lactic acid (PLA), high impact polystyrene (HIPS), and Nylon. Whilst these are all useful structural materials they are not electrically conductive and hence do not immediately lend themselves to the fabrication of antennas and waveguides for instance. Furthermore, not all these materials are good choices for high frequency electronics as they have rather more dielectric loss than is generally preferred. For example, there are reports of solely dielectric resonator antennas produced using FDM, [5,6] however the permittivity of these thermoplastics is generally too low to be of much value for such applications, unless loaded with fillers that can raise their dielectric constant. [7] In order to construct useful radio frequency (RF) devices, such as filters [8] and antennas, [9] conductors are essential to couple feeds, create antennas and form resonant structures. Many examples of conductive filaments have been demonstrated using thermoplastics loaded with particles, including carbon fiber, copper, and silver. [7,10] There are a number of issues faced when using these loaded filaments, from inherent drawbacks, such as relatively low conductivity and sensitivity to moisture, to technical shortcomings, including particles damaging or clogging extrusion nozzles. Whilst lower conductivity is not a barrier to their use, it does generally limit the performance of RF devices which require low loss. An extra complication arises when printing successive layers of conductive materials, resulting in a lower conductivity along the vertical direction (due to the reduced vertical contact between the extruded cylindrical filaments). [11,12] This anisotropic conductivity makes true 3D fabrication quite difficult and limited in scope.In this report, a novel fabrication method, based on casting Field's metal inside dielectric molds made via fused deposition modeling, is presented. Fused deposition modeling (FDM) has become one of the most common rapid prototyping methods. Whilst it generally produces good quality mechanical structures in thermoplastics, few reliable methods have been demonstrated that produce good quality 3D electrically c...