Superior Reliability of SAC105 Solder on BGA Package Pad with NiPdAu Coating

Huang, Chao; Rao, Li; Sun, Menglong; Hu, Anmin; Li, Ming

doi:10.1007/s11664-018-6515-z

Cited by 20 publications

(1 citation statement)

References 4 publications

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“…The correct signal waveform and transmission speed are ensured by optimising the wiring length and impedance ratios to minimise connection resistance, parasitic inductance, and capacitance [10,11]. (3) Standard specification: The generic function of specification means that the packaging has standard size, shape, number of pins, pitch, length etc., that can be matched with the printed circuit board (PCB), making it processable for the related production lines and equipment, offering standardisation and convenience for packaging users, board, and semiconductor manufacturers [7,12]. In summary, the packaging not only plays the role of protecting the chip, enhancing thermal conductivity, and reliability, but also acts as a bridge between the internal world of the chip and the external circuit [13,14].…”

Section: Introductionmentioning

confidence: 99%

Polymer‐based nanocomposites in semiconductor packaging

Sun

2023

IET Nanodielectrics

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Semiconductor packaging materials play a critical role in the development of semiconductor devices. They not only provide reliable protection and support, but also contribute to the electrical connection between the chip and the external circuit. Among many choices of packaging materials, polymer‐based nanocomposites have become the mainstream candidate due to their low cost, easy processability, and tunable properties. Materials with low dielectric constant and dielectric loss, high glass transition temperature, fast thermal conductivity, suitable coefficient of thermal expansion, low viscosity, and good processability are commonly required in semiconductor packaging, yet most polymers do not meet these criteria. Therefore, modulation of the polymer matrix, introduction of suitable fillers, and modification of the filler surface are often effective approaches to enhance the performance of the composites. Here, the authors first review current research progresses of polymer‐based nanocomposites for five different types of packaging applications, namely moulding compounds, thermal interface materials, underfills, die attach materials, and substrates. The authors then present prospects of developing next‐generation polymer‐based nanocomposites for advanced semiconductor packaging and propose some suggestions to solve the existing challenges.

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Section: Introductionmentioning

confidence: 99%

Polymer‐based nanocomposites in semiconductor packaging

Sun

2023

IET Nanodielectrics

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Time‐dependent density functional theory investigations on structural modification in carbazole‐based organic photosensitizers to improve electron injection in dye‐sensitized solar cell

Majid

Sana

Khan

et al. 2020

Int J of Quantum Chemistry

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The time‐dependent density functional theory approach, implemented at hybrid‐B3LYP, GGA‐PBE, and density functional‐based tight binding levels of theory, was used to model photoinjection in organic dye/TiO2 quantum dot to explore the prospects of improvement of dye‐sensitized solar cell (DSSC). The photosensitizer used in this study consisted of six carbazole‐based organic dyes, a cyanoacrylic acid group as an acceptor and an oligothiophene π‐bridge spacer. The modifications were made in the dyes by increasing the length of the spacer by adding thiophene and oxadiazole rings at different positions of the donor‐acceptor bridge. The structural variations appeared to alter the electronic and optical properties of dyes studied via energy levels and excitation spectra. The UV‐Vis spectra calculated for all the dyes in solvents exhibited a red shift in spectral peaks with an increase in the polarity of the solvents. The findings of the study pointed toward the indirect photoinjection of the dye‐(TiO2)96 complex for six different dyes. The substitution of the oxadiazole ring at the center and addition of a thiophene ring at the edge of the spacer produced two dyes that exhibited the lowest injection energies of 0.11 and 0.17 eV, along with the regeneration energies of 1.18 and 1.12 eV, respectively. The dyes reported here may have promising applications in photoanode for enhancing the performance of DSSC.

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Facile Synthesis of a NiCo₂O₄ Nanoparticles Mesoporous Carbon Composite as Electrode Materials for Supercapacitor

et al. 2020

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Combination the materials together is a direct and forceful strategy to improve the electrochemical properties of each raw material. Herein, we present the method of hydrothermal process and treatment/calcination combination that is easy to synthesize a NiCo2O4 nanoparticles‐mesoporous carbon composite (C/NiCo2O4). The result study electrochemical properties of materials revealed that the C/NiCo2O4 composite has excellent electrochemical properties compare with pristine NiCo2O4 or carbon. In particular, maximum specific capacitance of C/NiCo2O4 material at a current density of 1 A.g−1 is 204.28 F.g−1, meanwhile the Cs of carbon and NiCo2O4 are 25.06 F.g−1 and 178.78 F.g−1, respectively. In addition, C/NiCo2O4 material also showed excellent capacitance retention, Cs maintained to 90.35% after 3000 charge‐discharge continuous cycles. The results show that the C/NiCo2O4 is a promising material for application as supercapacitor electrode.

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Superior Reliability of SAC105 Solder on BGA Package Pad with NiPdAu Coating

Cited by 20 publications

References 4 publications

Polymer‐based nanocomposites in semiconductor packaging

Polymer‐based nanocomposites in semiconductor packaging

Time‐dependent density functional theory investigations on structural modification in carbazole‐based organic photosensitizers to improve electron injection in dye‐sensitized solar cell

Facile Synthesis of a NiCo₂O₄ Nanoparticles Mesoporous Carbon Composite as Electrode Materials for Supercapacitor

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Superior Reliability of SAC105 Solder on BGA Package Pad with NiPdAu Coating

Cited by 20 publications

References 4 publications

Polymer‐based nanocomposites in semiconductor packaging

Polymer‐based nanocomposites in semiconductor packaging

Time‐dependent density functional theory investigations on structural modification in carbazole‐based organic photosensitizers to improve electron injection in dye‐sensitized solar cell

Facile Synthesis of a NiCo2O4 Nanoparticles Mesoporous Carbon Composite as Electrode Materials for Supercapacitor

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Product

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Facile Synthesis of a NiCo₂O₄ Nanoparticles Mesoporous Carbon Composite as Electrode Materials for Supercapacitor