Arsenic antisite defects in p -GaAs grown by metal-organic chemical-vapor deposition and the EL2 defectThe effect of stress on defect creation and diffusion during impurity-free disordering of SiO x -capped n-GaAs epitaxial layers has been investigated using deep level transient spectroscopy. The oxygen content in the SiO x layer and the nature of the stress that it imposes on the GaAs layer were varied by changing the nitrous oxide flow rate, N, during plasma-enhanced chemical vapor deposition of the capping layer. The peak intensity of defects S1 and S4 increased with the increasing nitrous oxide flow rate to exhibit a maximum in the range 80 sccmϽNϽ200 sccm. Any further increase in N resulted in a decrease in peak defect intensity, which reached an almost constant value for N Ͼ350 sccm. On the other hand, the peak intensity of S2* increased linearly with N. We have explained the maximum in the intensity of defects S1 and S4 for 80 sccmϽNϽ200 sccm to be due to a corresponding maximum in the compressive stress which is experienced by the capped GaAs layer during annealing. Although the creation of S2*, which we have proposed to be a complex involving the gallium vacancy (V Ga ), is enhanced with the increasing compressive stress, it also becomes efficiently converted into the arsenic-antisite, As Ga . The compound effect of these opposing mechanisms results in a linear dependence of the peak intensity of S2* on N. This study is to the best of our knowledge the first to provide the evidence for the stress-dependent anti-correlation between V Ga -and As Ga -related defects in GaAs. We have also narrowed the origin of S1 to complexes involving arsenic interstitials, As i , and/or As Ga .