We report the room temperature observation of significant ballistic electron transport in shallow etched four-terminal mesoscopic devices fabricated on an InSb/AlInSb quantum well (QW) heterostructure with a crucial partitioned growth-buffer scheme. Ballistic electron transport is evidenced by a negative bend resistance signature which is quite clearly observed at 295 K and at current densities in excess of 10 6 A/cm 2 . This demonstrates unequivocally that by using effective growth and processing strategies, room temperature ballistic effects can be exploited in InSb/AlInSb QWs at practical device dimensions. Harnessing ballistic transport effects in low-dimensional structures at room temperature (RT) is a promising avenue for developing innovative nanoelectronic devices for applications including logic circuits, biosensing, and high-density data storage. Carbon-based systems such as carbon nanotubes (CNTs) 1,2 and graphene 3 have received considerable attention owing to their extraordinarily long mean free path (l 0 ) at RT (<50 lm in CNTs) and high current carrying capability, but the realization of very-large-scale-integration compatibility remains a fundamental challenge. In this respect, high mobility III-V semiconductors are technologically relevant. Several groups 4,5 have explored ballistic switching and rectifying concepts in InGaAs/InP quantum wells (QWs), where l 0 % 150 nm at 295 K. The operating efficiency of such devices is closely linked to the ratio of l 0 to the critical device dimension and is limited to $20% due to the small value of l 0 in such systems. Electron mobilities of l e % 45 000 cm 2 /Vs are routinely achieved in InSb/AlInSb QWs at 295 K-the largest reported of any III-V system. 6 For a typical electron density n e % 6 Â 10 11 cm À2