Suppression of Void Nucleation in High-Purity Aluminum via Dynamic Recrystallization

Noell, Philip; Sills, Ryan B.; Boyce, Brad Lee

doi:10.1007/s11661-019-05457-w

Cited by 6 publications

(4 citation statements)

References 53 publications

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“…Regardless of mechanism, if grain growth prevents cavitation, it may improve material resilience during high‐temperature deformation. While not examined in the present study, we would likewise expect dynamic recovery and recrystallization to impede void nucleation, as recently observed by the authors in high‐purity aluminum during room temperature deformation 27 …”

Section: Discussionsupporting

confidence: 61%

“…While not examined in the present study, we would likewise expect dynamic recovery and recrystallization to impede void nucleation, as recently observed by the authors in high-purity aluminum during room temperature deformation. 27…”

Section: Void Nucleation At Hagbsmentioning

confidence: 99%

“…Theoretical work by Lim indicates that dislocation pileups at grain boundaries would create a sufficiently large stress concentration to form voids 25 . Others have proposed that the intragranular accumulation of dislocations as subgrain boundaries or dislocation tangles leads to void formation, 1 akin to the mechanisms observed at room temperature 26–29 . Detailed ex situ studies of elevated‐temperature cavitation in Fe, Cu, and brass using transmission electron microscopy (TEM) suggest that both grain‐boundary defects and the accumulation of intragranular dislocations are critical to cavitation 30–33 .…”

Section: Introductionmentioning

confidence: 99%

“…25 Others have proposed that the intragranular accumulation of dislocations as subgrain boundaries or dislocation tangles leads to void formation, 1 akin to the mechanisms observed at room temperature. [26][27][28][29] Detailed ex situ studies of elevated-temperature cavitation in Fe, Cu, and brass using transmission electron microscopy (TEM) suggest that both grain-boundary defects and the accumulation of intragranular dislocations are critical to cavitation. [30][31][32][33] Others proposed that the combined stress concentration created by grain-boundary pileups at a sliding grain boundary leads to cavity formation.…”

Section: Introductionmentioning

confidence: 99%

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Identifying the microstructural features associated with void nucleation during elevated‐temperature deformation of copper

Noell

Deka

Sills

et al. 2022

Fatigue Fract Eng Mat Struct

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The microstructural-scale mechanisms that produce cracks in metals during deformation at elevated temperatures are relevant to applications that involve thermal exposure. Prior studies of cavitation during high-temperature deformation, for example, creep, suffered from an inability to directly observe the microstructural evolution that occurs during deformation and leads to void nucleation. The current study takes advantage of modern high-speed electron backscatter diffraction (EBSD) detectors to observe cavitation in oxygen-free, high-conductivity copper in situ during deformation at 300 C. Most voids formed at the triple junction between a twin boundary and a high-angle grain boundary (HAGB). This finding does not contradict previous studies that suggested that twins are resistant to cracking-it reveals that cracks in HAGBs originate at twin/HAGB triple junctions and that cracks preferentially grow along HAGBs rather than the accompanying twins. Atomistic simulations explored the origins of this observation and suggest that twin/HAGB triple junctions are microstructural weak points.

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Section: Discussionsupporting

confidence: 61%

Section: Void Nucleation At Hagbsmentioning

confidence: 99%