Surface Inspection of Cu-Cu Non-Thermal Compression Bonding for Wafer-to-Wafer 3D Stacking

Abstract

A new monitoring system combining SPD (Surface Potential Difference) imaging technique and XRD analysis has shown to be effective in understanding of plasma influence and monitoring plasma process in wafer bonding. This work will give a way to improve bonding yield in the hybrid Cu-Cu non-thermal compression bonding process through monitoring and optimizing plasma process conditions.