Surface Mount Solder Joint Long‐term Reliability: Design, Testing, Prediction

Engelmaier, W.

doi:10.1108/eb037660

Cited by 55 publications

(17 citation statements)

References 11 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…3 and 4 previously) show clearly that the 84CTBGA outperforms the 192CABGA by a wide margin. 1,22,23 The 192CABGA package construction and very high die to package ratio generate higher shear strains in the solder joints resulting in earlier failures. This is demonstrated by the microscopic Moiré interferometry data in Fig.…”

Section: Effect Of Component Typementioning

confidence: 99%

“…Solder joint fatigue failures occur due to the coefficient of thermal expansion (CTE) mismatch between the component and the printed circuit board (PCB). 1 Although industry consortia had identified the Sn-Ag-Cu eutectic (nominally Sn3.8Ag0.7Cu) as the best option, the alloy that was used most widely in the first phase of implementation was the slightly hypoeutectic SAC305 alloy (Sn3.0Ag0.5Cu). SAC305 was endorsed by both the Japanese Electronics Industry Association (JEITA) and the IPC Solder Product Value Council (SPVC).…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Thermal Fatigue Evaluation of Pb-Free Solder Joints: Results, Lessons Learned, and Future Trends

Coyle¹,

Sweatman

Arfaei

2015

JOM

View full text Add to dashboard Cite

Section: Effect Of Component Typementioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Thermal Fatigue Evaluation of Pb-Free Solder Joints: Results, Lessons Learned, and Future Trends

Coyle¹,

Sweatman

Arfaei

2015

JOM

View full text Add to dashboard Cite

“…The Englemaier-Wild solder creep-fatigue equation [154][155][156][157][158][159][160][161][162][163] relates the cyclic total strain energy, to the median cyclic fatigue life for both isothermal-mechanical and thermal cycling:…”

Section: Fatigue Life Predictionmentioning

confidence: 99%

“…Depiction of the Effects of the Accumulating Fatigue Damage[32] Fatigue test results are obtained by cycling smooth or notched specimens until failure, and are presented in a form of S-N diagram (where S is the stress amplitude, and N the number of cycles to failure) as shown inFigure 1.10. Since the 1950s, researchers have developed several models to predict the number of cycles to failure of solder materials including the Engelmaier-Wild equation [32], Palmgren-Miner linear damage law, Coffin-Manson relation [33], etc.…”

mentioning

confidence: 99%

The Effects of Aging of the Cyclic Stress-Strain and Fatigue Behaviors of Lead Free Solders

Mustafa

Roberts

Suhling

et al. 2013

Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; M

View full text Add to dashboard Cite

Solder joints in electronic assemblies are typically subjected to thermal cycling, either in actual application or in accelerated life testing used for qualification. Mismatches in the thermal expansion coefficients of the assembly materials cause the solder joints to be subjected to cyclic (positive and negative) mechanical strains and stresses. This cyclic loading leads to thermomechanical fatigue damage that involves damage accumulation, crack initiation, crack propagation, and failure. In addition, the microstructure, mechanical response, and failure behavior of lead free solder joints in electronic assemblies are constantly evolving when exposed to isothermal aging and/or thermal cycling environments. While the effects of aging on solder constitutive behavior (stress-strain and creep) have been examined in some detail, there have been no prior studies on the effects of aging on solder failure and fatigue behavior. Aging leads to both grain and phase coarsening, and can cause recrystallization at Sn grain boundaries. Such changes are closely tied to the damage that occurs during cyclic mechanical loading. In this investigation, we have examined the effects of aging on the cyclic stress-strain behavior and fatigue life of lead free solders. Uniaxial solder test specimens (SAC105 and SAC305) have been prepared and subjected to cyclic stress/strain loading at different aging conditions. A four-parameter hyperbolic tangent empirical model has been used to fit the entire cyclic stress-strain curve and the hysteresis loop size (area) was calculated using definite integration for a given strain limit. This area represents the energy dissipated per cycle, which is correlated to the damage accumulation in the joint. Using the recorded cyclic stress-strain curves, the evolution of the solder hysteresis loops with aging have been characterized and empirically modeled. Similar to solder stress-strain and creep behavior, there is a strong effect of aging on the hysteresis loop size (and thus the rate of damage accumulation) in the solder specimens. Fatigue experiments were also performed, where the uniaxial specimens were subjected to cyclic loading over a particular strain range until failure. Fatigue failure in the experiments was defined to occur when there was a 50% peak load drop during mechanical cycling. Prior to testing, the specimens were aged (preconditioned) at 125 °C for various aging times, and then the samples were subjected to cyclic loading at room temperature (25 °C). It was found that aging decreased the mechanical fatigue life, and the effects of aging on the peak load drop have been studied. It has also been observed that degradations in the fatigue/failure behavior of the lead free solders with aging are highly accelerated for lower silver content alloys (e.g., SAC105). Various empirical failure criteria such as the Coffin-Manson model and the Morrow model have been used to fit the measured data, and the parameters in the models have been determined as a function of the aging conditions.

show abstract

“…Although well studied, a board level joint scale reliability study of Ag micro-alloyed Sn58Bi solder joints produced with SMT has not been reported and this is essential to assess its viability as a SnPb replacement. The combination of thermal fatigue and solder joint creep is considered to be a predominant failure mechanism of electronic assemblies, and it is of particular interest to end users requiring high reliability [30]. ATC is a widely used reliability evaluation technique that simultaneously produces static and strain-induced microstructural evolution in solders as a result of thermal expansion mismatch, thereby accelerating fatigue and creep damage mechanisms [10,12,[31][32][33][34][35][36].…”

Section: Introductionmentioning

confidence: 99%

Improved Reliability and Mechanical Performance of Sn58Bi Solder Alloys

Ren¹,

Collins²

2019

Preprint

View full text Add to dashboard Cite

Microstructural and mechanical properties of the eutectic Sn58Bi and micro-alloyed Sn57.6Bi0.4Ag solder alloys were compared. With the addition of Ag micro-alloy, the tensile strength was improved and this is attributed to a combination of microstructure refinement and an Ag3Sn precipitation hardening mechanism. However, ductility is slightly deteriorated due to the brittle nature of the Ag3Sn intermetallic compounds (IMCs). Additionally, a board level reliability study of Ag micro-alloyed Sn58Bi solder joints produced utilising a surface-mount technology (SMT) process, were assessed under accelerated temperature cycling (ATC) conditions. Results reveal that micro-alloyed Sn57.6Bi0.4Ag has a higher characteristic lifetime with a narrower failure distribution. This enhanced reliability corresponds with improved bulk mechanical properties. It is postulated that Ag3Sn IMCs are located at the Sn-Bi phase boundaries and suppress the solder microstructure from coarsening during the temperature cycling, hereby extending the time to failure.

show abstract

Surface Mount Solder Joint Long‐term Reliability: Design, Testing, Prediction

Cited by 55 publications

References 11 publications

Thermal Fatigue Evaluation of Pb-Free Solder Joints: Results, Lessons Learned, and Future Trends

Thermal Fatigue Evaluation of Pb-Free Solder Joints: Results, Lessons Learned, and Future Trends

The Effects of Aging of the Cyclic Stress-Strain and Fatigue Behaviors of Lead Free Solders

Improved Reliability and Mechanical Performance of Sn58Bi Solder Alloys

Contact Info

Product

Resources

About