“…In particular, they are almost non-sensitive to external air and humidity, which make them very applicable. Many authors such as Saitou et al [22,23] and also Gomez et al [24] successfully used this substrate in the electrodeposition of Ni and other metals. We here present a comparative study of the scan rate and substrate effects in the three cases for a particular thickness range of well-coalesced films mostly solicited for the fabrication of various modern devices.…”