Surface Roughness and Wettability of SAC/CNT Lead Free Solder

Ismail, Norliza; Ismail, Roslina; Ubaidillah, Nik Khairul Amilin Nik; Jalar, Azman; Zain, Norazwani Muhammad

doi:10.4028/www.scientific.net/msf.857.73

Cited by 5 publications

(3 citation statements)

References 4 publications

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“…The nanostructured powder particles had higher surface energy than the unmilled powder. Therefore, the spread ratio improved [43,44]. The area spread ratio was 63% for 5 h milled powder, and increased rapidly to 80% for 35 h milled powder due to the rapid nanostructuring of powder particles.…”

Section: Resultsmentioning

confidence: 97%

Solderability, Microstructure, and Thermal Characteristics of Sn-0.7Cu Alloy Processed by High-Energy Ball Milling

Sharma

Chae

et al. 2020

Metals

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In this work, we have investigated the role of high-energy ball milling (HEBM) on the evolution of microstructure, thermal, and wetting properties of an Sn-0.7Cu alloy. We ball-milled the constituent Sn and Cu powders in eutectic composition for 45 h. The microstructural studies were carried out using optical and scanning electron microscopy. The melting behavior of the powder was examined using differential scanning calorimetry (DSC). We observed a considerable depression in the melting point of the Sn-0.7Cu alloy (≈7 °C) as compared to standard cast Sn-0.7Cu alloys. The resultant crystallite size and lattice strain of the ball-milled Sn-0.7Cu alloy were 76 nm and 1.87%, respectively. The solderability of the Sn-0.7Cu alloy was also improved with the milling time, due to the basic processes occurring during the HEBM.

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Section: Resultsmentioning

confidence: 97%

Solderability, Microstructure, and Thermal Characteristics of Sn-0.7Cu Alloy Processed by High-Energy Ball Milling

Sharma

Chae

et al. 2020

Metals

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“…The Fe-BNNT composite plating also showed a good solderability of more than 70% spreading factor in all three temperature ranges, almost as good as the Fe plating. The Fe-BN particle composite plating decreased to nearly 50% at 573 K, and showed a solder spreading factor of 60% or less at 673 K. This was equivalent to Fe plating at 623 K. Generally, a rougher surface is considered to improve solderability, 14) but Fig. 12 shows that the surface of Fe-BN particle composite plating is rougher than that of Fe plating, but solderability is not improved.…”

Section: Evaluation Of the Solderabilitymentioning

confidence: 96%

Erosion Resistance of Iron-Boron Nitride Composite Plating to Molten Lead-Free Solder

Watanabe¹,

Hatsuzawa²,

Ogata³

et al. 2022

Mater. Trans.

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In accordance with the EU RoHS Directive, the use of Sn3 mass%Ag0.5 mass%Cu lead-free solder (SAC305) has become the standard in the manufacturing of electronics. Since SAC305 contains more tin than the conventional tin-lead eutectic solder, erosion of the Fe plating frequently occurs on a hand soldering iron tip and a point soldering machine nozzle. In this study, to extend the life of the Fe plating layer, we investigated the applicability of a composite plating in which Fe is combined with the boron nitride (BN) compounds. We used BN particles as the bulk material, and boron nitride nanotubes (BNNT) as a nanomaterial, to fabricate the regarded composite materials. A solderability test and an erosion resistance test were conducted on the composite plating layer, made of both Fe-BN particles and Fe-BNNTs composites. In the solderability test, the spreading factor of SAC305 on the Fe-BN particle and on the Fe-BNNT composite platings were about the same as, or a little decreased compared to, that of the bare Fe plating. The SAC305 solder was not repelled by either composite plating. In the erosion resistance test, the Fe-BNNT composite plating performed the best, and had the lowest erosion depth. The erosion depths of the Fe-BN particle composite plating and the Fe plating ranged from about 6 to 24 times greater, respectively, than those of the Fe-BNNT composite plating layer, confirming that, in a nanomaterial BNNT-base, composite diffusion of Fe into SAC 305 can be suppressed.

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“…Solder joints on various morphologies of Cu substrates are examined for quality and reliability using microstructure inspection and intermetallic compound layer measurement at the interfaces of solder joints and Cu substrates [7,8]. Specifically, microstructure measurements are used in the assessment because they are performed at the micrometre scale and in cross-sectional views that reveal the internal structure of solder connections with Cu substrate.…”

Section: Introductionmentioning

confidence: 99%

Influence of Copper Substrate Roughness on the Growth of Intermetallic Compounds Layer in SAC305 Solder Joints

Atiqah

Rahim

Jalar

et al. 2022

J. Phys.: Conf. Ser.

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This study aimed to evaluate the effect of surface morphology of copper (Cu) substrate on the intermetallic compound (IMC) growth and interfacial reactions when soldered with SAC305 lead-free solder during a thermal aging process. The surface morphology conditions of the Cu substrate influence the growth activity of the IMC layer. This study used different grits of silicon carbide (SiC) abrasive paper (400, 800 and 1200) to grind the Cu substrate to produce different surface roughness. The resulting Cu surface morphologies were examined using an infinite focus microscope (IFM), and the parameters used in this stereometric analysis were profile roughness. Hand soldering was used to melt the SAC305 solder on the Cu substrates with different surface roughness. Subsequently, the samples were subjected to an aging temperature of 150 °C for 800 hours to grow the IMC layers. Thermal aging increased the IMC thickness at the Cu-SAC305 interfaces. After thermal aging, the IMC layer thickness and related parameters were measured and analyzed with the IFM. The growth of the IMC layer thickness depended on the different surface morphology of the substrate when the aging temperatures and Cu materials were maintained in this study. In general, the IMC morphology for the rougher Cu substrate had a scallop-shaped and uniformed layer compared to those IMC from the smooth Cu substrate. The Cu substrate ground surface roughness with 400 grit SiC abrasive paper produced an average roughness, Ra of 505.02 nm; this roughness produced the thinnest IMC layers compared to the different Cu substrates ground by SiC abrasive paper of different grits.

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Surface Roughness and Wettability of SAC/CNT Lead Free Solder

Cited by 5 publications

References 4 publications

Solderability, Microstructure, and Thermal Characteristics of Sn-0.7Cu Alloy Processed by High-Energy Ball Milling

Solderability, Microstructure, and Thermal Characteristics of Sn-0.7Cu Alloy Processed by High-Energy Ball Milling

Erosion Resistance of Iron-Boron Nitride Composite Plating to Molten Lead-Free Solder

Influence of Copper Substrate Roughness on the Growth of Intermetallic Compounds Layer in SAC305 Solder Joints

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