1994
DOI: 10.1007/bf00348262
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Surface-science aspects of plasma-assisted etching

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Cited by 47 publications
(22 citation statements)
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“…In this way, the surface will become more efficient at trapping incoming radicals, leading to higher deposition rates. [32][33][34] The atomic density of the films was calculated by combining the IBA results with direct measurements of the films thickness by stylus profilometry, which yielded values within the range of 0.7Ϯ0.1ϫ10 23 at/cm 3 . In our case, the ion current density measured at the sample holder increased linearly from 50 to 255 A/cm 2 as the C 2 F 6 flux increased from 0 to 1.6 sccm revealing an increasing contribution of implanted ions in growing film.…”
Section: Resultsmentioning
confidence: 99%
“…In this way, the surface will become more efficient at trapping incoming radicals, leading to higher deposition rates. [32][33][34] The atomic density of the films was calculated by combining the IBA results with direct measurements of the films thickness by stylus profilometry, which yielded values within the range of 0.7Ϯ0.1ϫ10 23 at/cm 3 . In our case, the ion current density measured at the sample holder increased linearly from 50 to 255 A/cm 2 as the C 2 F 6 flux increased from 0 to 1.6 sccm revealing an increasing contribution of implanted ions in growing film.…”
Section: Resultsmentioning
confidence: 99%
“…FC plasmas have been the subject of extensive applied and fundamental research to understand the modification of polymers and silicon surfaces. [28][29][30][31][32][33][34] Deposition of FC films can improve the physical properties of inexpensive polymer materials by imparting them with protective, protein resistant, gas semipermeable, low dielectric constant, or unusual optical properties. FC films on polymers have a wide variety of applications in biomaterials, optics, chemical sensors, and electronics.…”
Section: B Role Of Polyatomic Ions In Plasma-surface Modificationmentioning
confidence: 99%
“…The C 3 F 5 ϩ ion maintains most of its molecular character at 25 eV, although the kinetic to internal energy transfer is sufficient to fragment at least some of its COC and͞or COF bonds at 50 eV. Polymer films grow most readily from plasma feedgases with F͞C ratio less than ϳ2.5 (6,10). Thus, C 3 F 6 feedgases more readily grow polymer films than CF 4 , C 2 F 6 , or C 3 F 8 (19,58).…”
Section: Figmentioning
confidence: 99%
“…Plasma processing is used to produce biocompatible surfaces for tissue culture plates, contact lenses, medical implants, and other biomedical devices; photoresists for semiconductor lithography; optical coatings; polymer films for packaging and adhesives; semipermeable membranes; and chemical sensors (1)(2)(3)(4)(5)(6). The modification of polymers and silicon surfaces by fluorocarbon plasmas has been particularly well studied from both practical and fundamental standpoints (1,(7)(8)(9)(10)(11)(12)(13). For example, fluoropolymers deposited from plasmas have been examined for use as diffusion barriers in drug delivery systems and vascular implant devices that resist protein fouling (6,14).…”
mentioning
confidence: 99%
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