Surface wave communication system for on-chip and off-chip interconnects

Karkar, Ammar; Al-Dujaily, Ra'ed; Yakovlev, Alex; Tong, Kin‐Fai; Mak, Terrence

doi:10.1145/2401716.2401720

Cited by 14 publications

(17 citation statements)

References 19 publications

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“…It also compares between the proposed architecture when DWA algorithm used as selection function with same architecture when RR is used. It obviously demonstrates reductions in NoC power consumption by 12-23%, which is up to 6% enhancement over our previous work [42] because of the DWA algorithm utilising the proposed fabric more effectively. Moreover, it shows that as the NoC size increases for most cases the power saving ratio is increased because of the increasing distances between nodes, which increases the global communication problem.…”

Section: Power Consumptionmentioning

confidence: 60%

Hybrid wire‐surface wave interconnects for next‐generation networks‐on‐chip

Karkar

Turner²,

Tong

et al. 2013

IET Computers & Digital Techniques

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Networks-on-chip (NoC) is a communication paradigm that has emerged to tackle different on-chip challenges and satisfy different demands in terms of high performance and economical interconnect implementation. However, merely metal-based NoC pursuit offers limited scalability with the relentless technology scaling especially in global communications. To meet the scalability demand, this study proposes a new hybrid architecture empowered by both metal interconnect and Zenneck surface waves interconnects (SWIs). This architecture reduces the NoC average hop count between any communication pairs, which has been reflected as a better average delay and throughput. Furthermore, SWI enables more efficient power dissipation and faster cross the chip signal propagation. The authors' initial results based on a cycle-accurate simulator demonstrate the effectiveness of the proposed system architecture, such as significant power reduction (23%), large average delay reduction (34%) and higher throughput (35%) compared with regular NoC. These results are achieved with negligible hardware and area overhead. This study explores promising potentials of SWI for future complex global communication.

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Section: Power Consumptionmentioning

confidence: 60%

Hybrid wire‐surface wave interconnects for next‐generation networks‐on‐chip

Karkar

Turner²,

Tong

et al. 2013

IET Computers & Digital Techniques

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“…Surface wave interconnect is an emerging wireless communication fabric that has been demonstrated to be power efficient and with high data throughput for on-chip communication [12]. Previous contributions on SW have focused network architecture and performance with considerations of arbitration, packet routing and efficient handling of multicast packets [12].…”

Section: Related Workmentioning

confidence: 99%

“…Previous contributions on SW have focused network architecture and performance with considerations of arbitration, packet routing and efficient handling of multicast packets [12]. However, optimizing the communication fabric to improve reliability wireless interface which is a major issue in WiNoCs have not received much attention.…”

Section: Related Workmentioning

confidence: 99%

“…Wireless communication fabric based on the Zenneck surface wave (SW) concept has been proposed as an emerging wireless communication fabric that is power efficient with improved data throughput for long distance communication [12]. The surface wave propagates on a specially designed sheet which is an inhomogeneous plane that supports electromagnetic wave transmission.…”

Section: Introductionmentioning

confidence: 99%

“…Moreover, a transceiver used in traditional RF or millimeter wave design can be employed for surface wave propagation. However, previous contributions on SW have not focused on optimizing the communication fabric to improve reliability wireless interface [12]. We propose a highly reliable SW communication fabric along with an efficient transducer interface that is able to match the signal integrity of short range wired NoCs.…”

Section: Introductionmentioning

confidence: 99%

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A Resilient 2-D Waveguide Communication Fabric for Hybrid Wired-Wireless NoC Design

Agyeman

Vien

Ahmadinia

et al. 2017

IEEE Trans. Parallel Distrib. Syst.

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Hybrid wired-wireless Network-on-Chip (WiNoC) has emerged as an alternative solution to the poor scalability and performance issues of conventional wireline NoC design for future System-on-Chip (SoC). Existing feasible wireless solution for WiNoCs in the form of millimeter wave (mm-Wave) relies on free space signal radiation which has high power dissipation with high degradation rate in the signal strength per transmission distance. Moreover, over the lossy wireless medium, combining wireless and wireline channels drastically reduces the total reliability of the communication fabric. Surface wave has been proposed as an alternative wireless technology for low power on-chip communication. With the right design considerations, the reliability and performance benefits of the surface wave channel could be extended. In this paper, we propose a surface wave communication fabric for emerging WiNoCs that is able to match the reliability of traditional wireline NoCs. First, we propose a realistic channel model which demonstrates that existing mm-Wave WiNoCs suffers from not only free-space spreading loss (FSSL) but also molecular absorption attenuation (MAA), especially at high frequency band, which reduces the reliability of the system. Consequently, we employ a carefully designed transducer and commercially available thin metal conductor coated with a low cost dielectric material to generate surface wave signals with improved transmission gain. Our experimental results demonstrate that the proposed communication fabric can achieve a 5dB operational bandwidth of about 60GHz around the center frequency (60GHz). By improving the transmission reliability of wireless layer, the proposed communication fabric can improve maximum sustainable load of NoCs by an average of 20.9% and 133.3% compared to existing WiNoCs and wireline NoCs, respectively.

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