“…Normally, SiC has been prepared by the high temperature approach ( > 1000°C), including solid state reaction [6], carbothermal reduction [7,8], sol-gel process [9,10], thermal decomposition [11], self-propagating hightemperature route [12], electrospinning [13][14][15], chemical vapor deposition [16] and molten salt synthesis [17,18]. Recently, Qian et al have developed hydrothermal/solvothermal technique to prepare SiC nanomaterials at low temperature (120-700°C) [19][20][21][22]. However, SiC particles obtained by the above methods often have sharp edges and corners and wide size distributions [23], which are apt to scratch wafers and cause rough surfaces.…”